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Laser based ultrasound measurements of optical absorption depth in epoxy resins

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UNSPECIFIED (2002) Laser based ultrasound measurements of optical absorption depth in epoxy resins. In: Conference on Lasers in Material Processing and Manufacturing, OCT 16-18, 2002, SHANGHAI, PEOPLES R CHINA.

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Abstract

Pulsed lasers can generate ultrasound from stresses due to rapid thermal expansion. In this low power thermoelastic regime the material is not damaged. This paper concentrates on epoxy resins and aims to relate the observed amplitude of the longitudinal wave to the optical absorption depth of the epoxy. The ultrasound is generated using a high power pulsed laser and the absolute amplitude of the ultrasound is measured with a Michelson interferometer. In the thermoelastic regime, the laser beam is focused onto the sample, causing rapid expansion in times that are comparable to the rise time of the laser pulse. In metals, the laser radiation is absorbed in the thin electromagnetic skin depth but in non-metals the phenomenon is dominated by the optical absorption depth. The latter can vary from a few microns to several millimetres for materials such as epoxy resins. As a consequence, a bigger volume of the material is affected, the temperature rise is less and the amplitude of the longitudinal wave is greater. This condition is referred to as "a buried thermoclastic source". Two lasers were used in this study: a TEA CO2 and a XeCl excimer laser. The results are compared with optical transmission measurements.

Item Type: Conference Item (UNSPECIFIED)
Subjects: Q Science > QC Physics
Series Name: PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE)
Journal or Publication Title: LASERS IN MATERIAL PROCESSING AND MANUFACTURING
Publisher: SPIE-INT SOC OPTICAL ENGINEERING
ISBN: 0-8194-4704-8
ISSN: 0277-786X
Editor: Deng, SS and Okada, T and Behler, K and Wang, XZ
Date: 2002
Volume: 4915
Number of Pages: 7
Page Range: pp. 298-304
Publication Status: Published
Title of Event: Conference on Lasers in Material Processing and Manufacturing
Location of Event: SHANGHAI, PEOPLES R CHINA
Date(s) of Event: OCT 16-18, 2002
URI: http://wrap.warwick.ac.uk/id/eprint/10238

Data sourced from Thomson Reuters' Web of Knowledge

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