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Ultrasonic thickness gauging using a dry couplant at elevated temperatures

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UNSPECIFIED (2001) Ultrasonic thickness gauging using a dry couplant at elevated temperatures. In: 27th Annual Review of Progress in Quantitative Nondestructive Evaluation, JUL 16-20, 2000, IOWA STATE UNIV, AMES, IA.

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Abstract

This paper describes some experiments using a deformable dry couplant material attached to piezoelectric probes used in a send-receive mode. It has a low acoustic attenuation coefficient and can be 'cold cast' at room temperature and pressure. Because the material is highly deformable it can be used on very rough surfaces. Experiments have been carried out that use the dry couplant for normal incidence compression wave inspection up to temperatures of 370 degrees C.

Item Type: Conference Item (UNSPECIFIED)
Subjects: T Technology > TA Engineering (General). Civil engineering (General)
T Technology > TK Electrical engineering. Electronics Nuclear engineering
Q Science > QC Physics
Series Name: REVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION
Journal or Publication Title: REVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION, VOLS 20A AND 20B
Publisher: AMER INST PHYSICS
ISBN: 1-56396-988-2
Editor: Thompson, DO and Chimenti, DE
Date: 2001
Volume: 557
Number: Part A&B
Number of Pages: 4
Page Range: pp. 1600-1603
Publication Status: Published
Title of Event: 27th Annual Review of Progress in Quantitative Nondestructive Evaluation
Location of Event: IOWA STATE UNIV, AMES, IA
Date(s) of Event: JUL 16-20, 2000
URI: http://wrap.warwick.ac.uk/id/eprint/10278

Data sourced from Thomson Reuters' Web of Knowledge

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