Micromachining of TiNi shape memory alloy by excimer laser ablation
UNSPECIFIED (2001) Micromachining of TiNi shape memory alloy by excimer laser ablation. In: Conference on Device and Process Technologies for MEMS and Microelectronics II, DEC 17-19, 2001, ADELAIDE, AUSTRALIA.Full text not available from this repository.
In this paper we investigate excimer laser micromachining of TiNi shape memory alloy using an image projection system as an alternative to photolithographic patterning. We report on the characteristics of material removal by KrF excimer laser induced ablation at 248 run. and the dependence of material removal rates on laser parameters such as fluence and pulse frequency. Fluences at the workpiece using a 10x projection lens were up to 2.5 J cm(-2) with pulse repetition rates up to 100 Hz. Conventional chrome-on-quartz; masks were used for pattern transfer. Material removal mechanisms and rates of material removal are compared with those observed during excimer laser micromachining of polymers and ceramics and limitations on achievable lateral and depth resolution explored. Data obtained by a variety of characterisation methods are correlated to assess the effects of laser induced damage.
|Item Type:||Conference Item (UNSPECIFIED)|
|Subjects:||Q Science > QC Physics|
|Series Name:||PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE)|
|Journal or Publication Title:||DEVICE AND PROCESS TECHNOLOGIES FOR MEMS AND MICROELECTRONICS II|
|Publisher:||SPIE-INT SOC OPTICAL ENGINEERING|
|Number of Pages:||8|
|Page Range:||pp. 88-95|
|Title of Event:||Conference on Device and Process Technologies for MEMS and Microelectronics II|
|Location of Event:||ADELAIDE, AUSTRALIA|
|Date(s) of Event:||DEC 17-19, 2001|
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