UNSPECIFIED (2001) Micromachining of TiNi shape memory alloy by excimer laser ablation. In: Conference on Device and Process Technologies for MEMS and Microelectronics II, DEC 17-19, 2001, ADELAIDE, AUSTRALIA.

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Abstract

In this paper we investigate excimer laser micromachining of TiNi shape memory alloy using an image projection system as an alternative to photolithographic patterning. We report on the characteristics of material removal by KrF excimer laser induced ablation at 248 run. and the dependence of material removal rates on laser parameters such as fluence and pulse frequency. Fluences at the workpiece using a 10x projection lens were up to 2.5 J cm(-2) with pulse repetition rates up to 100 Hz. Conventional chrome-on-quartz; masks were used for pattern transfer. Material removal mechanisms and rates of material removal are compared with those observed during excimer laser micromachining of polymers and ceramics and limitations on achievable lateral and depth resolution explored. Data obtained by a variety of characterisation methods are correlated to assess the effects of laser induced damage.

Item Type:	Conference Item (UNSPECIFIED)
Subjects:	Q Science > QC Physics
Series Name:	PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE)
Journal or Publication Title:	DEVICE AND PROCESS TECHNOLOGIES FOR MEMS AND MICROELECTRONICS II
Publisher:	SPIE-INT SOC OPTICAL ENGINEERING
ISBN:	0-8194-4322-0
ISSN:	0277-786X
Editor:	Chiao, JC
Date:	2001
Volume:	4592
Number of Pages:	8
Page Range:	pp. 88-95
Publication Status:	Published
Title of Event:	Conference on Device and Process Technologies for MEMS and Microelectronics II
Location of Event:	ADELAIDE, AUSTRALIA
Date(s) of Event:	DEC 17-19, 2001
URI:	http://wrap.warwick.ac.uk/id/eprint/10283

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