The Library
Mechanically enhanced electrical conductivity of polydimethylsiloxane-based composites by a hot embossing process
Tools
Tools
Tools
Gao, Xiaolong, Huang, Yao, He, Xiaoxiang, Fan, Xiaojing, Liu, Ying, Xu, Hong, Wu, Daming and Wan, Chaoying (2019) Mechanically enhanced electrical conductivity of polydimethylsiloxane-based composites by a hot embossing process. Polymers, 11 (1). 56. doi:10.3390/polym11010056 ISSN 2073-4360.
|
PDF
WRAP-mechanically-enhanced-electrical-conductivity-polydimethylsiloxane-based-composites-hot-embossing-process-Wan-2019.pdf - Published Version - Requires a PDF viewer. Available under License Creative Commons Attribution 4.0. Download (4Mb) | Preview |
Official URL: https://doi.org/10.3390/polym11010056
Abstract
Electrically conductive polymer composites are in high demand for modern technologies, however, the intrinsic brittleness of conducting conjugated polymers and the moderate electrical conductivity of engineering polymer/carbon composites have highly constrained their applications. In this work, super high electrical conductive polymer composites were produced by a novel hot embossing design. The polydimethylsiloxane (PDMS) composites containing short carbon fiber (SCF) exhibited an electrical percolation threshold at 0.45 wt % and reached a saturated electrical conductivity of 49 S/m at 8 wt % of SCF. When reducing the sample thickness from 1.0 to 0.1 mm by the hot embossing process, a compression-induced percolation threshold occurred at 0.3 wt %, while the electrical conductivity was further enhanced to 378 S/m at 8 wt % SCF. Furthermore, the addition of a second nanofiller of 1 wt %, such as carbon nanotube or conducting carbon black, further increased the electrical conductivity of the PDMS/SCF (8 wt %) composites to 909 S/m and 657 S/m, respectively. The synergy of the densified conducting filler network by the mechanical compression and the hierarchical micro-/nano-scale filler approach has realized super high electrically conductive, yet mechanically flexible, polymer composites for modern flexible electronics applications.
| Item Type: | Journal Article | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Subjects: | Q Science > QD Chemistry | |||||||||
| Divisions: | Faculty of Science, Engineering and Medicine > Engineering > WMG (Formerly the Warwick Manufacturing Group) | |||||||||
| SWORD Depositor: | Library Publications Router | |||||||||
| Library of Congress Subject Headings (LCSH): | Polymeric composites -- Conductivity | |||||||||
| Journal or Publication Title: | Polymers | |||||||||
| Publisher: | M D P I AG | |||||||||
| ISSN: | 2073-4360 | |||||||||
| Official Date: | 2 January 2019 | |||||||||
| Dates: |
|
|||||||||
| Volume: | 11 | |||||||||
| Number: | 1 | |||||||||
| Article Number: | 56 | |||||||||
| DOI: | 10.3390/polym11010056 | |||||||||
| Status: | Peer Reviewed | |||||||||
| Publication Status: | Published | |||||||||
| Access rights to Published version: | Open Access (Creative Commons) | |||||||||
| Date of first compliant deposit: | 21 January 2019 | |||||||||
| Date of first compliant Open Access: | 21 January 2019 | |||||||||
| RIOXX Funder/Project Grant: |
|
Request changes or add full text files to a record
Repository staff actions (login required)
 |
View Item |
Downloads
Downloads per month over past year
