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Development, characterisation and simulation of wafer bonded Si-on-SiC substrates
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Gammon, P. M., Chan, Chun Wa, Li, F., Gity, F., Trajkovic, T., Pathirana, V., Flandre, D. and Kilchytska, V. (2018) Development, characterisation and simulation of wafer bonded Si-on-SiC substrates. Materials Science in Semiconductor Processing, 78 . pp. 69-74. doi:10.1016/j.mssp.2017.10.020 ISSN 1369-8001.
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Official URL: http://dx.doi.org/10.1016/j.mssp.2017.10.020
| Item Type: | Journal Article | ||||||
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| Divisions: | Faculty of Science, Engineering and Medicine > Engineering > Engineering | ||||||
| Journal or Publication Title: | Materials Science in Semiconductor Processing | ||||||
| Publisher: | Pergamon | ||||||
| ISSN: | 1369-8001 | ||||||
| Official Date: | May 2018 | ||||||
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| Volume: | 78 | ||||||
| Page Range: | pp. 69-74 | ||||||
| DOI: | 10.1016/j.mssp.2017.10.020 | ||||||
| Status: | Peer Reviewed | ||||||
| Publication Status: | Published | ||||||
| Access rights to Published version: | Open Access (Creative Commons) |
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