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Challenges of junction temperature sensing in SiC power MOSFETs
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Ortiz Gonzalez, Jose Angel and Alatise, Olayiwola M. (2019) Challenges of junction temperature sensing in SiC power MOSFETs. In: 2019 10th International Conference on Power Electronics and ECCE Asia (ICPE 2019 - ECCE Asia), Busan, Korea (South), 27-30 May 2019 pp. 891-898.
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Official URL: https://ieeexplore.ieee.org/document/8797281
Abstract
Junction temperature sensing is an integral part of both on-line and off-line condition monitoring where direct access the bare die surface is not available. Given a defined power input, the junction temperature enables the estimation of the junction-to-case thermal resistance, which is a key indicator of packaging failure mechanisms like solder voiding and cracks. The use of temperature sensitive electrical parameters (TSEPs) has widely been proposed as a means of junction temperature sensing however, in SiC power devices there are certain challenges regarding the use of TSEPs. Bias Temperature Instability (BTI) from charge trapping in the gate dielectric causes threshold voltage drift, which in SiC affects some of the key TSEPs including ON-state resistance, body diode forward voltage as well as the turn-ON current commutation rate. This paper reviews the challenges of junction temperature sensing in SiC power devices, the impact of BTI on TSEPs and how different researchers have approached the issue of power cycling SiC power devices and modules.
Item Type: | Conference Item (Paper) | ||||||||||
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Divisions: | Faculty of Science, Engineering and Medicine > Engineering > Engineering | ||||||||||
Publisher: | IEEE | ||||||||||
Official Date: | 15 August 2019 | ||||||||||
Dates: |
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Page Range: | pp. 891-898 | ||||||||||
Status: | Peer Reviewed | ||||||||||
Publication Status: | Published | ||||||||||
Access rights to Published version: | Restricted or Subscription Access | ||||||||||
Date of first compliant deposit: | 23 August 2019 | ||||||||||
Conference Paper Type: | Paper | ||||||||||
Title of Event: | 2019 10th International Conference on Power Electronics and ECCE Asia (ICPE 2019 - ECCE Asia) | ||||||||||
Type of Event: | Conference | ||||||||||
Location of Event: | Busan, Korea (South) | ||||||||||
Date(s) of Event: | 27-30 May 2019 | ||||||||||
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