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A multi-pronged approach to low-pressure Cu sintering using surface-modified particles, substrate and chip metallization

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Bhogaraju, Sri Krishna, Mokhtari, Omid, Pascucci, Jacopo, Conti, Fosca, Kotadia, Hiren and Elger, Gordon (2019) A multi-pronged approach to low-pressure Cu sintering using surface-modified particles, substrate and chip metallization. International Symposium on Microelectronics, 2019 (1). 000387-000392. doi:10.4071/2380-4505-2019.1.000387

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Official URL: https://doi.org/10.4071/2380-4505-2019.1.000387

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Abstract

High temperature power electronics based on wide-bandgap semiconductors have prominent applications, such as automotive, aircrafts, space exploration, oil/gas extraction, electricity distribution. Die-attach bonding process is an essential process in the realization of high temperature power devices. Here Cu offers to be a promising alternative to Ag, especially because of thermal and mechanical properties on par with Ag and a cost advantage by being a factor 100 cheaper than Ag. With the aim to achieve a low-pressure Cu sintering process, a low cost wet chemical etching process is developed to selectively etch Zn from brass to create nano-porous surface modifications to enhance sinterability, enabling sintering with low bonding pressure of 1MPa and at temperatures below 300°C. However, high tendency of Cu to oxidize poses a major challenge in realizing stable interconnects. For this purpose, in this contribution, we present the use of polyethylene-glycol 600 as reducing binder in the formulation of the Cu sintering paste. Finally, we propose a multi-pronged approach based on three crucial factors: surface-modified substrates, nanostructured surface modifications on micro-scale Cu-alloy particles and use of a reducing binder in the Cu particle paste.

Item Type: Journal Article
Divisions: Faculty of Science > WMG (Formerly the Warwick Manufacturing Group)
SWORD Depositor: Library Publications Router
Journal or Publication Title: International Symposium on Microelectronics
Publisher: International Microelectronics and Packaging Society (IMAPS)
ISSN: 2380-4505
Official Date: October 2019
Dates:
DateEvent
October 2019Published
17 September 2019Accepted
Volume: 2019
Number: 1
Page Range: 000387-000392
DOI: 10.4071/2380-4505-2019.1.000387
Status: Peer Reviewed
Publication Status: Published
Access rights to Published version: Restricted or Subscription Access
Copyright Holders: © 2019 International Microelectronics Assembly and Packaging Society

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