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A multi-pronged approach to low-pressure Cu sintering using surface-modified particles, substrate and chip metallization
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Bhogaraju, Sri Krishna, Mokhtari, Omid, Pascucci, Jacopo, Conti, Fosca, Kotadia, Hiren and Elger, Gordon (2019) A multi-pronged approach to low-pressure Cu sintering using surface-modified particles, substrate and chip metallization. International Symposium on Microelectronics, 2019 (1). 000387-000392. doi:10.4071/2380-4505-2019.1.000387 ISSN 2380-4505.
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WRAP-multi-pronged-approach-low-pressure-surface-modified-particles-Kotadia-2019.pdf - Accepted Version Embargoed item. Restricted access to Repository staff only - Requires a PDF viewer. Download (1316Kb) |
Official URL: https://doi.org/10.4071/2380-4505-2019.1.000387
Abstract
High temperature power electronics based on wide-bandgap semiconductors have prominent applications, such as automotive, aircrafts, space exploration, oil/gas extraction, electricity distribution. Die-attach bonding process is an essential process in the realization of high temperature power devices. Here Cu offers to be a promising alternative to Ag, especially because of thermal and mechanical properties on par with Ag and a cost advantage by being a factor 100 cheaper than Ag. With the aim to achieve a low-pressure Cu sintering process, a low cost wet chemical etching process is developed to selectively etch Zn from brass to create nano-porous surface modifications to enhance sinterability, enabling sintering with low bonding pressure of 1MPa and at temperatures below 300°C. However, high tendency of Cu to oxidize poses a major challenge in realizing stable interconnects. For this purpose, in this contribution, we present the use of polyethylene-glycol 600 as reducing binder in the formulation of the Cu sintering paste. Finally, we propose a multi-pronged approach based on three crucial factors: surface-modified substrates, nanostructured surface modifications on micro-scale Cu-alloy particles and use of a reducing binder in the Cu particle paste.
| Item Type: | Journal Article | ||||||
|---|---|---|---|---|---|---|---|
| Divisions: | Faculty of Science, Engineering and Medicine > Engineering > WMG (Formerly the Warwick Manufacturing Group) | ||||||
| SWORD Depositor: | Library Publications Router | ||||||
| Journal or Publication Title: | International Symposium on Microelectronics | ||||||
| Publisher: | International Microelectronics and Packaging Society (IMAPS) | ||||||
| ISSN: | 2380-4505 | ||||||
| Official Date: | October 2019 | ||||||
| Dates: |
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| Volume: | 2019 | ||||||
| Number: | 1 | ||||||
| Page Range: | 000387-000392 | ||||||
| DOI: | 10.4071/2380-4505-2019.1.000387 | ||||||
| Status: | Peer Reviewed | ||||||
| Publication Status: | Published | ||||||
| Access rights to Published version: | Restricted or Subscription Access | ||||||
| Copyright Holders: | © 2019 International Microelectronics Assembly and Packaging Society | ||||||
| Date of first compliant deposit: | 16 March 2020 |
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