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Novel approach to copper sintering using surface enhanced brass micro flakes for microelectronics packaging

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Bhogaraju, Sri Krishna, Conti, Fosca, Kotadia, Hiren, Keim, Simon, Tetzlaff, Ulrich and Elger, Gordon (2020) Novel approach to copper sintering using surface enhanced brass micro flakes for microelectronics packaging. Journal of Alloys and Compounds, 844 . 156043. doi:10.1016/j.jallcom.2020.156043

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Official URL: http://dx.doi.org/10.1016/j.jallcom.2020.156043

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Abstract

Copper pastes suitable for low temperature and low pressure die-attach bonding were developed to enable sintering at 275 °C under N2 atmosphere. First, brass flakes were treated with HCl to selectively etch Zn and to realize enhanced surface modifications on the flakes. Then, polyethylene glycol was added as binder to the modified flakes due to its reducing effects on copper oxides and its property to prevent agglomeration. Shear strength of ca. 50 MPa was achieved while sintering with 10 MPa bonding pressure thereby providing suitable, easy and low-cost sintering pastes for microelectronics packaging applications.

Item Type: Journal Article
Subjects: Q Science > QD Chemistry
T Technology > TA Engineering (General). Civil engineering (General)
T Technology > TN Mining engineering. Metallurgy
Divisions: Faculty of Science > WMG (Formerly the Warwick Manufacturing Group)
Library of Congress Subject Headings (LCSH): Sintering -- Research, Copper -- Heat treatment, Metals -- Heat treatment, Alloys -- Heat treatment, Surfaces -- Microstructure
Journal or Publication Title: Journal of Alloys and Compounds
Publisher: Elsevier BV
ISSN: 0925-8388
Official Date: December 2020
Dates:
DateEvent
December 2020Published
20 June 2020Available
10 June 2020Accepted
Date of first compliant deposit: 2 July 2020
Volume: 844
Article Number: 156043
DOI: 10.1016/j.jallcom.2020.156043
Status: Peer Reviewed
Publication Status: Published
Access rights to Published version: Restricted or Subscription Access
RIOXX Funder/Project Grant:
Project/Grant IDRIOXX Funder NameFunder ID
ProLoMa 13FH147PX6Bundesministerium für Bildung und Forschunghttp://dx.doi.org/10.13039/501100002347
IQLED 13FH044PX8Bundesministerium für Bildung und Forschunghttp://dx.doi.org/10.13039/501100002347

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