The Library
Novel approach to copper sintering using surface enhanced brass micro flakes for microelectronics packaging
Tools
Tools
Tools
Bhogaraju, Sri Krishna, Conti, Fosca, Kotadia, Hiren, Keim, Simon, Tetzlaff, Ulrich and Elger, Gordon (2020) Novel approach to copper sintering using surface enhanced brass micro flakes for microelectronics packaging. Journal of Alloys and Compounds, 844 . 156043. doi:10.1016/j.jallcom.2020.156043
![[img]](http://wrap.warwick.ac.uk/style/images/fileicons/application_pdf.png) |
PDF
WRAP-Novel-approach-copper-sintering-surface-brass-micro-flakes-microelectronics-Kotadia-2020.pdf - Accepted Version Embargoed item. Restricted access to Repository staff only until 20 June 2021. Contact author directly, specifying your specific needs. - Requires a PDF viewer. Available under License Creative Commons Attribution Non-commercial No Derivatives 4.0. Download (2071Kb) |
Official URL: http://dx.doi.org/10.1016/j.jallcom.2020.156043
Abstract
Copper pastes suitable for low temperature and low pressure die-attach bonding were developed to enable sintering at 275 °C under N2 atmosphere. First, brass flakes were treated with HCl to selectively etch Zn and to realize enhanced surface modifications on the flakes. Then, polyethylene glycol was added as binder to the modified flakes due to its reducing effects on copper oxides and its property to prevent agglomeration. Shear strength of ca. 50 MPa was achieved while sintering with 10 MPa bonding pressure thereby providing suitable, easy and low-cost sintering pastes for microelectronics packaging applications.
| Item Type: | Journal Article | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Subjects: | Q Science > QD Chemistry T Technology > TA Engineering (General). Civil engineering (General) T Technology > TN Mining engineering. Metallurgy |
|||||||||
| Divisions: | Faculty of Science > WMG (Formerly the Warwick Manufacturing Group) | |||||||||
| Library of Congress Subject Headings (LCSH): | Sintering -- Research, Copper -- Heat treatment, Metals -- Heat treatment, Alloys -- Heat treatment, Surfaces -- Microstructure | |||||||||
| Journal or Publication Title: | Journal of Alloys and Compounds | |||||||||
| Publisher: | Elsevier BV | |||||||||
| ISSN: | 0925-8388 | |||||||||
| Official Date: | December 2020 | |||||||||
| Dates: |
|
|||||||||
| Date of first compliant deposit: | 2 July 2020 | |||||||||
| Volume: | 844 | |||||||||
| Article Number: | 156043 | |||||||||
| DOI: | 10.1016/j.jallcom.2020.156043 | |||||||||
| Status: | Peer Reviewed | |||||||||
| Publication Status: | Published | |||||||||
| Access rights to Published version: | Restricted or Subscription Access | |||||||||
| RIOXX Funder/Project Grant: |
|
Request changes or add full text files to a record
Repository staff actions (login required)
 |
View Item |
