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Heat current anticorrelation effects leading to thermal conductivity reduction in nanoporous Si
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de Sousa Oliveira, Laura, Hosseini, S. Aria, Greaney, Alex and Neophytou, Neophytos (2020) Heat current anticorrelation effects leading to thermal conductivity reduction in nanoporous Si. Physical Review B, 102 (20). 205405. doi:10.1103/PhysRevB.102.205405 ISSN 2469-9950.
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WRAP-heat-current-anticorrelation-effects-leading-thermal-conductivity-reduction-nanoporous-si-Neophytou-2020.pdf - Accepted Version - Requires a PDF viewer. Download (1404Kb) | Preview |
Official URL: http://dx.doi.org/10.1103/PhysRevB.102.205405
Abstract
Prevailing nanostructuring strategies focus on increasing phonon scattering and reducing the mean-free-path of phonons across the spectrum. In nanoporous Si materials, for example, boundary scattering reduces thermal conductivity drastically. In this work, we identify an unusual anticorrelated specular phonon scattering effect which can result in additional reductions in thermal conductivity of up to ∼80% for specific nanoporous geometries. We further find evidence that this effect has its origin in heat trapping between large pores with narrow necks. As the heat becomes trapped between the pores, phonons undergo multiple specular reflections such that their contribution to the thermal conductivity is partly undone. We find this effect to be wave-vector dependent at low temperatures. We use large-scale molecular-dynamics simulations, wave-packet analysis, as well as an analytical model to illustrate the anticorrelation effect, evaluate its impact on thermal conductivity, and detail how it can be controlled to manipulate phonon transport in nanoporous materials.
| Item Type: | Journal Article | ||||||||
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| Subjects: | Q Science > QC Physics T Technology > T Technology (General) T Technology > TA Engineering (General). Civil engineering (General) T Technology > TK Electrical engineering. Electronics Nuclear engineering |
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| Divisions: | Faculty of Science, Engineering and Medicine > Engineering > Engineering | ||||||||
| Library of Congress Subject Headings (LCSH): | Thermal conductivity , Nanostructured materials -- Thermal properties, Thermoelectric materials, Nanotechnology, Molecular dynamics -- Simulation methods, Heat flux | ||||||||
| Journal or Publication Title: | Physical Review B | ||||||||
| Publisher: | American Physical Society | ||||||||
| ISSN: | 2469-9950 | ||||||||
| Official Date: | November 2020 | ||||||||
| Dates: |
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| Volume: | 102 | ||||||||
| Number: | 20 | ||||||||
| Article Number: | 205405 | ||||||||
| DOI: | 10.1103/PhysRevB.102.205405 | ||||||||
| Status: | Peer Reviewed | ||||||||
| Publication Status: | Published | ||||||||
| Access rights to Published version: | Restricted or Subscription Access | ||||||||
| Copyright Holders: | ©2020 American Physical Society | ||||||||
| Date of first compliant deposit: | 13 November 2020 | ||||||||
| Date of first compliant Open Access: | 16 November 2020 | ||||||||
| RIOXX Funder/Project Grant: |
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