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On the development of the 3C-SiC power law and its applicability for the evaluation of termination structures

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Arvanitopoulos, Anastasios, Perkins, Samuel, Antoniou, Marina, Li, Fan, Jennings, Mike, Gyftakis, Konstantinos N. and Lophitis, Neophytos (2018) On the development of the 3C-SiC power law and its applicability for the evaluation of termination structures. In: The 14th International Seminar on Power Semiconductors (ISPS 2018), Prague, Czech Republic, 29-31 Aug 2018. Published in: International Symposium on Power Semiconductors (ISPS)

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Abstract

The 3C-Silicon Carbide (SiC) has been investigated as the suitable material for medium rated power device applications. Compared to growing 4H-SiC on hexagonal SiC, growing 3C-SiC on Si wafers is quite cost-effective and has recently resulted in epitaxial layers with thickness capable of supporting voltages of this magnitude. In this work, the power law of 3C-SiC is derived for the first time towards predicting the breakdown voltage of vertical Schottky Barrier Diodes (SBDs) based on this wide bandgap (WBG) semiconductor material. To ensure the predicted blocking capabilities from the 3C-SiC power law expression will be supported to the largest extend in fabricated SBDs, termination topologies are adjusted and investigated by performing extensive Technology Computer Aided Design (TCAD) simulations. A comprehensive map is developed to allow the decision on the termination concept for 3C-SiC-on-Si SBDs to be made based on efficiency and area requirement criteria.

Item Type: Conference Item (Paper)
Divisions: Faculty of Science, Engineering and Medicine > Engineering > Engineering
Journal or Publication Title: International Symposium on Power Semiconductors (ISPS)
Official Date: August 2018
Dates:
DateEvent
August 2018Published
Status: Peer Reviewed
Publication Status: Published
Access rights to Published version: Restricted or Subscription Access
Conference Paper Type: Paper
Title of Event: The 14th International Seminar on Power Semiconductors (ISPS 2018)
Type of Event: Conference
Location of Event: Prague, Czech Republic
Date(s) of Event: 29-31 Aug 2018
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