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An anchoring array assembly method for enhancing the electrical conductivity of composites of polypropylene and hybrid fillers
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Zhu, Jiashu, Wan, Chaoying, Xu, Hong, Liu, Ying, Zhuang, Jian, Sun, Jingyao, Gao, Xiaolong, McNally, Tony, Huang, Yao and Wu, Daming (2021) An anchoring array assembly method for enhancing the electrical conductivity of composites of polypropylene and hybrid fillers. Composites Science and Technology, 211 . 108846. doi:10.1016/j.compscitech.2021.108846 ISSN 0266-3538.
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WRAP-anchoring-array-assembly-method-enhancing-electrical-conductivity-composites-polypropylene-hybrid-fillers-McNally-2021.pdf - Accepted Version - Requires a PDF viewer. Available under License Creative Commons Attribution Non-commercial No Derivatives 4.0. Download (4Mb) | Preview |
Official URL: http://dx.doi.org/10.1016/j.compscitech.2021.10884...
Abstract
Constructing an interconnected filler-filler network in a polymer matrix is essential for enhancing the electrical conductivity of polymer composites. This work describes an Anchoring Array Assembly method for distribution of copper particles (CP) and carbon fibers (CF) in a polypropylene (PP) matrix. Constrained by a predesigned array anchoring template, the CP distribution achieved a high packing density in the PP matrix during compression molding which is key for filling the gaps between CFs, as well as for forming an interconnected hybrid filler network. Using the fixed array anchoring design, the dispersion and flow behavior of the conductive fillers and the polymer matrix are critical. When the inclination angle between the groove of the anchor mold and the horizontal plane was greater than 11.5 °, the migration of CP in the molten PP when in the anchor mold during the hot embossing process is restricted. The most conductive composites were obtained when the CPs were densely arranged in a triangular format. The conductive filler network was determined by the preset dense triangular "island-bridge" structure of the customized microarray mold. The conductivity of the composites prepared by the anchoring array assembly method reached 137.70 S/m, some 52 times higher than that prepared by traditional hot embossing methods with the same filler loading.
Item Type: | Journal Article | |||||||||
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Subjects: | Q Science > QD Chemistry T Technology > TA Engineering (General). Civil engineering (General) |
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Divisions: | Faculty of Science, Engineering and Medicine > Engineering > WMG (Formerly the Warwick Manufacturing Group) | |||||||||
Library of Congress Subject Headings (LCSH): | Composite materials, Composite materials -- Electric properties , Polymers, Polymers -- Electric properties , Conducting polymers | |||||||||
Journal or Publication Title: | Composites Science and Technology | |||||||||
Publisher: | Pergamon | |||||||||
ISSN: | 0266-3538 | |||||||||
Official Date: | 28 July 2021 | |||||||||
Dates: |
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Volume: | 211 | |||||||||
Article Number: | 108846 | |||||||||
DOI: | 10.1016/j.compscitech.2021.108846 | |||||||||
Status: | Peer Reviewed | |||||||||
Publication Status: | Published | |||||||||
Access rights to Published version: | Restricted or Subscription Access | |||||||||
Date of first compliant deposit: | 17 May 2021 | |||||||||
Date of first compliant Open Access: | 11 May 2022 | |||||||||
RIOXX Funder/Project Grant: |
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