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Status and prospects of cubic silicon carbide power electronics device technology

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Li, Fan, Roccaforte, Fabrizio, Greco, Giuseppe, Fiorenza, Patrick, La Via, Francesco, Pérez-Tomas, Amador, Evans, Jonathan, Fisher, Craig, Monaghan, Finn, Mawby, Philip. A. and Jennings, Mike (2021) Status and prospects of cubic silicon carbide power electronics device technology. Materials, 14 (19). e5831. doi:10.3390/ma14195831

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Official URL: https://doi.org/10.3390/ma14195831

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Abstract

Wide bandgap (WBG) semiconductors are becoming more widely accepted for use in power electronics due to their superior electrical energy efficiencies and improved power densities. Although WBG cubic silicon carbide (3C-SiC) displays a modest bandgap compared to its commercial counterparts (4H-silicon carbide and gallium nitride), this material has excellent attributes as the WBG semiconductor of choice for low-resistance, reliable diode and MOS devices. At present the material remains firmly in the research domain due to numerous technological impediments that hamper its widespread adoption. The most obvious obstacle is defect-free 3C-SiC; presently, 3C-SiC bulk and heteroepitaxial (on-silicon) display high defect densities such as stacking faults and antiphase boundaries. Moreover, heteroepitaxy 3C-SiC-on-silicon means low temperature processing budgets are imposed upon the system (max. temperature limited to ~1400 °C) limiting selective doping realisation. This paper will give a brief overview of some of the scientific aspects associated with 3C-SiC processing technology in addition to focussing on the latest state of the art results. A particular focus will be placed upon key process steps such as Schottky and ohmic contacts, ion implantation and MOS processing including reliability. Finally, the paper will discuss some device prototypes (diodes and MOSFET) and draw conclusions around the prospects for 3C-SiC devices based upon the processing technology presented.

Item Type: Journal Article
Subjects: Q Science > QC Physics
T Technology > TP Chemical technology
Divisions: Faculty of Science > Engineering
SWORD Depositor: Library Publications Router
Library of Congress Subject Headings (LCSH): Silicon carbide, Power electronics, Wide gap semiconductors -- Materials
Journal or Publication Title: Materials
Publisher: MDPI
ISSN: 1996-1944
Official Date: 5 October 2021
Dates:
DateEvent
5 October 2021Published
25 September 2021Accepted
Volume: 14
Number: 19
Article Number: e5831
DOI: 10.3390/ma14195831
Status: Peer Reviewed
Publication Status: Published
Access rights to Published version: Open Access
RIOXX Funder/Project Grant:
Project/Grant IDRIOXX Funder NameFunder ID
CHALLENGE / 720827European Commissionhttp://dx.doi.org/10.13039/501100000780
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