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Highly reliable die-attach bonding with etched brass flakes
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Bhogaraju, Sri Krishna, Schmid, Maximilian, Kotadia, Hiren R., Conti, Fosca and Elger, Gordon (2021) Highly reliable die-attach bonding with etched brass flakes. In: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC), Gothenburg, Sweden, 13-16 Sep 2021. Published in: Proceedings of the 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) pp. 1-6. ISBN 9780956808677. doi:10.23919/EMPC53418.2021.9584967
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Official URL: http://dx.doi.org/10.23919/EMPC53418.2021.9584967
Abstract
Highly reliable microparticle sinter paste based on etched brass flakes is developed. A low temperature (275∘C), low pressure (10 MPa) and fast (5 min) die-attach process resulting in sintered interconnects with an average shear strength of 60 MPa is realized. The use of polyethylene glycol 600 (PEG600) in the sinter paste formulation allows an in-situ reduction of copper oxide and sintering in an open bond chamber under a constant nitrogen flow with no influence of residual oxygen. Even under high stress thermal shock cycling, the sintered interconnects realized by the etched brass flakes show no drop in shear strength after 1000 cycles. Porosity of the interconnect affects the oxidation with time. In pure Cu flakes, stacking over each other, a preferential growth in (220) grain orientation is observed.
Item Type: | Conference Item (Paper) | ||||
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Divisions: | Faculty of Science, Engineering and Medicine > Engineering > WMG (Formerly the Warwick Manufacturing Group) | ||||
Journal or Publication Title: | Proceedings of the 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) | ||||
Publisher: | IEEE | ||||
ISBN: | 9780956808677 | ||||
Book Title: | 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) | ||||
Official Date: | 13 November 2021 | ||||
Dates: |
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Page Range: | pp. 1-6 | ||||
DOI: | 10.23919/EMPC53418.2021.9584967 | ||||
Status: | Peer Reviewed | ||||
Publication Status: | Published | ||||
Reuse Statement (publisher, data, author rights): | © 2021 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. | ||||
Access rights to Published version: | Restricted or Subscription Access | ||||
Copyright Holders: | IEEE | ||||
Conference Paper Type: | Paper | ||||
Title of Event: | 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) | ||||
Type of Event: | Conference | ||||
Location of Event: | Gothenburg, Sweden | ||||
Date(s) of Event: | 13-16 Sep 2021 |
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