Polysiloxane interpenetrating network materials as electronic device encapsulants: Synthesis and properties
UNSPECIFIED (1997) Polysiloxane interpenetrating network materials as electronic device encapsulants: Synthesis and properties. In: 8th International Workshop on Glasses and Ceramics from Gels, ALGARVE, PORTUGAL, SEP 18-22, 1995. Published in: JOURNAL OF SOL-GEL SCIENCE AND TECHNOLOGY, 8 (1-3). pp. 599-602.Full text not available from this repository.
Thermally curable interpenetrating networks employing short and long chain components were successfully prepared via the sol-gel route. Their mechanical properties were assessed and correlated to their composition and structure. The role of the organic cross-links was found to be a larger determinant of the mechanical properties than the inorganic network. Their low frequency dielectric properties were investigated and found to be comparable to those of conventional encapsulation materials. Observed mass losses at 523 K ranged between 3-5% after 1000 minutes, the suspected mechanism being the development of organic cross-links.
|Item Type:||Conference Item (UNSPECIFIED)|
|Subjects:||T Technology > TP Chemical technology|
|Journal or Publication Title:||JOURNAL OF SOL-GEL SCIENCE AND TECHNOLOGY|
|Publisher:||KLUWER ACADEMIC PUBL|
|Number of Pages:||4|
|Page Range:||pp. 599-602|
|Title of Event:||8th International Workshop on Glasses and Ceramics from Gels|
|Location of Event:||ALGARVE, PORTUGAL|
|Date(s) of Event:||SEP 18-22, 1995|
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