Heating performance of electrolytic heat-treatment in aqueous solution by pulse current
UNSPECIFIED (1997) Heating performance of electrolytic heat-treatment in aqueous solution by pulse current. In: 3rd Asia Pacific Conference on Materials Processing, HONG KONG, HONG KONG, NOV 12-14, 1996. Published in: JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 63 (1-3). pp. 833-838.Full text not available from this repository.
Conventional surface heat-treatment processes are carried out at high temperature, hence both the equipment and the operation costs are high. However, heat treatment is an important linkage-industry to support other manufacturing industries. This paper introduces an advance surface heat- treatment technique that can be operated at room temperature, with low cost and easy control, which hence improves its competitiveness. This is an electrolytic heat-treatment method in aqueous solution, especially using pulse current as a new aspect in the area of surface-hardening technologies. After a feasibility study, a special high-power pulse rectifier and an electrolyte bath system were designed and fabricated to investigate this new technology of electrolytic heat-treatment The performance of the electrolytic heat-treatment process has been evaluated. Comparing with direct current, different heating rates under pulse current are easily secured by varying the pulse period, the ON:OFF ratio and the voltage. More controllable and ideal operating conditions are expected using electrolytic heat-treatment in aqueous solution to surface harden medium-carbon steel.
|Item Type:||Conference Item (UNSPECIFIED)|
T Technology > TS Manufactures
T Technology > TA Engineering (General). Civil engineering (General)
|Journal or Publication Title:||JOURNAL OF MATERIALS PROCESSING TECHNOLOGY|
|Publisher:||ELSEVIER SCIENCE SA LAUSANNE|
|Official Date:||January 1997|
|Number of Pages:||6|
|Page Range:||pp. 833-838|
|Title of Event:||3rd Asia Pacific Conference on Materials Processing|
|Location of Event:||HONG KONG, HONG KONG|
|Date(s) of Event:||NOV 12-14, 1996|
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