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Heating performance of electrolytic heat-treatment in aqueous solution by pulse current
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UNSPECIFIED (1997) Heating performance of electrolytic heat-treatment in aqueous solution by pulse current. In: 3rd Asia Pacific Conference on Materials Processing, NOV 12-14, 1996, HONG KONG, HONG KONG.
Full text not available from this repository.Abstract
Conventional surface heat-treatment processes are carried out at high temperature, hence both the equipment and the operation costs are high. However, heat treatment is an important linkage-industry to support other manufacturing industries. This paper introduces an advance surface heat- treatment technique that can be operated at room temperature, with low cost and easy control, which hence improves its competitiveness. This is an electrolytic heat-treatment method in aqueous solution, especially using pulse current as a new aspect in the area of surface-hardening technologies. After a feasibility study, a special high-power pulse rectifier and an electrolyte bath system were designed and fabricated to investigate this new technology of electrolytic heat-treatment The performance of the electrolytic heat-treatment process has been evaluated. Comparing with direct current, different heating rates under pulse current are easily secured by varying the pulse period, the ON:OFF ratio and the voltage. More controllable and ideal operating conditions are expected using electrolytic heat-treatment in aqueous solution to surface harden medium-carbon steel.
| Item Type: | Conference Item (UNSPECIFIED) |
|---|---|
| Subjects: | T Technology T Technology > TS Manufactures T Technology > TA Engineering (General). Civil engineering (General) |
| Journal or Publication Title: | JOURNAL OF MATERIALS PROCESSING TECHNOLOGY |
| Publisher: | ELSEVIER SCIENCE SA LAUSANNE |
| ISSN: | 0924-0136 |
| Date: | January 1997 |
| Volume: | 63 |
| Number: | 1-3 |
| Number of Pages: | 6 |
| Page Range: | pp. 833-838 |
| Publication Status: | Published |
| Title of Event: | 3rd Asia Pacific Conference on Materials Processing |
| Location of Event: | HONG KONG, HONG KONG |
| Date(s) of Event: | NOV 12-14, 1996 |
| URI: | http://wrap.warwick.ac.uk/id/eprint/18110 |
Data sourced from Thomson Reuters' Web of Knowledge
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