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DIFFUSION CONTROLLED REACTIONS IN AU/PB-SN SOLDER SYSTEM
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UNSPECIFIED (1992) DIFFUSION CONTROLLED REACTIONS IN AU/PB-SN SOLDER SYSTEM. MATERIALS SCIENCE AND TECHNOLOGY, 8 (9). pp. 817-824.
Full text not available from this repository, contact author.Abstract
The microstructures resulting from the reaction between gold and Pb-Sn solder at temperatures of 80, 125, 140, and 160-degrees-C have been studied in the scanning electron microscope and measurements have been made of the reaction kinetics. In the initial stages, the growth rate of the layers of Au-Sn intermetallic product was found to be proportional to t1/2 with an activation energy of (0.84 +/- 0.02) eV. At longer times, the growth rate fell below the t1/2 dependence. This was thought to be owing to a restriction in the supply of gold to the reaction.
| Item Type: | Journal Article | ||||
|---|---|---|---|---|---|
| Subjects: | T Technology > TA Engineering (General). Civil engineering (General) T Technology > TN Mining engineering. Metallurgy |
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| Journal or Publication Title: | MATERIALS SCIENCE AND TECHNOLOGY | ||||
| Publisher: | INST MATERIALS | ||||
| ISSN: | 0267-0836 | ||||
| Official Date: | September 1992 | ||||
| Dates: |
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| Volume: | 8 | ||||
| Number: | 9 | ||||
| Number of Pages: | 8 | ||||
| Page Range: | pp. 817-824 | ||||
| Publication Status: | Published |
Data sourced from Thomson Reuters' Web of Knowledge
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