The Library
DIFFUSION CONTROLLED REACTIONS IN AU/PB-SN SOLDER SYSTEM
Tools
UNSPECIFIED (1992) DIFFUSION CONTROLLED REACTIONS IN AU/PB-SN SOLDER SYSTEM. MATERIALS SCIENCE AND TECHNOLOGY, 8 (9). pp. 817-824. ISSN 0267-0836.
Research output not available from this repository.
Request-a-Copy directly from author or use local Library Get it For Me service.
Abstract
The microstructures resulting from the reaction between gold and Pb-Sn solder at temperatures of 80, 125, 140, and 160-degrees-C have been studied in the scanning electron microscope and measurements have been made of the reaction kinetics. In the initial stages, the growth rate of the layers of Au-Sn intermetallic product was found to be proportional to t1/2 with an activation energy of (0.84 +/- 0.02) eV. At longer times, the growth rate fell below the t1/2 dependence. This was thought to be owing to a restriction in the supply of gold to the reaction.
Item Type: | Journal Article | ||||
---|---|---|---|---|---|
Subjects: | T Technology > TA Engineering (General). Civil engineering (General) T Technology > TN Mining engineering. Metallurgy |
||||
Journal or Publication Title: | MATERIALS SCIENCE AND TECHNOLOGY | ||||
Publisher: | INST MATERIALS | ||||
ISSN: | 0267-0836 | ||||
Official Date: | September 1992 | ||||
Dates: |
|
||||
Volume: | 8 | ||||
Number: | 9 | ||||
Number of Pages: | 8 | ||||
Page Range: | pp. 817-824 | ||||
Publication Status: | Published |
Data sourced from Thomson Reuters' Web of Knowledge
Request changes or add full text files to a record
Repository staff actions (login required)
View Item |