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DIFFUSION CONTROLLED REACTIONS IN AU/PB-SN SOLDER SYSTEM

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UNSPECIFIED (1992) DIFFUSION CONTROLLED REACTIONS IN AU/PB-SN SOLDER SYSTEM. MATERIALS SCIENCE AND TECHNOLOGY, 8 (9). pp. 817-824.

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Abstract

The microstructures resulting from the reaction between gold and Pb-Sn solder at temperatures of 80, 125, 140, and 160-degrees-C have been studied in the scanning electron microscope and measurements have been made of the reaction kinetics. In the initial stages, the growth rate of the layers of Au-Sn intermetallic product was found to be proportional to t1/2 with an activation energy of (0.84 +/- 0.02) eV. At longer times, the growth rate fell below the t1/2 dependence. This was thought to be owing to a restriction in the supply of gold to the reaction.

Item Type: Journal Article
Subjects: T Technology > TA Engineering (General). Civil engineering (General)
T Technology > TN Mining engineering. Metallurgy
Journal or Publication Title: MATERIALS SCIENCE AND TECHNOLOGY
Publisher: INST MATERIALS
ISSN: 0267-0836
Official Date: September 1992
Dates:
DateEvent
September 1992UNSPECIFIED
Volume: 8
Number: 9
Number of Pages: 8
Page Range: pp. 817-824
Publication Status: Published

Data sourced from Thomson Reuters' Web of Knowledge

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