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STRENGTH DEGRADATION OF GROUND AND ETCHED SI SURFACES

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UNSPECIFIED. (1990) STRENGTH DEGRADATION OF GROUND AND ETCHED SI SURFACES. INSTITUTE OF PHYSICS CONFERENCE SERIES (111). pp. 493-495. ISSN 0951-3248

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Abstract

The design of a three point bending test machine for assessing the strength of small specimens is outined. Preliminary results are reported of the strength of sawn and ground silicon as a function of the surface depth removed by etching.

Item Type: Journal Article
Subjects: Q Science > QC Physics
Journal or Publication Title: INSTITUTE OF PHYSICS CONFERENCE SERIES
Publisher: IOP PUBLISHING LTD
ISSN: 0951-3248
Date: 1990
Number: 111
Number of Pages: 3
Page Range: pp. 493-495
Publication Status: Published
URI: http://wrap.warwick.ac.uk/id/eprint/22848

Data sourced from Thomson Reuters' Web of Knowledge

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