Swan, I. R. (Ian R.), Bryant, Angus T. and Mawby, P. A. (Philip A.) (2008) Fast thermal models for power device packaging. In: IEEE Industry-Applications-Society Annual Meeting, Alberta, Canada, Oct 05-09, 2008. Published in: Industry Applications Society. IEEE - IAS Annual Meeting. Conference Record, Vol.1-5 pp. 1457-1464.

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Abstract

This paper describes the development and implementation of an analytical thermal model for fast and accurate thermal simulations of power device modules. A Fourier-based solution is used to solve the heat equation in two dimensions. The solution can describe the variation of temperature through the structure versus time. The thermal model is extremely fast to simulate compared to finite-element (FEM) approaches. The new model has been implemented in MATLAB/Simulink. The model has been validated against FEM simulations and the difference between the two models has been illustrated. The required aspects of heat diffusion are captured successfully by the Fourier-based model.

Item Type:	Conference Item (UNSPECIFIED)
Subjects:	T Technology > TK Electrical engineering. Electronics Nuclear engineering
Divisions:	Faculty of Science > Engineering
Library of Congress Subject Headings (LCSH):	Electric current converters -- Computer simulation, Electric current converters -- Thermal properties, Heat -- Conduction -- Computer simulation, Heat -- Conduction -- Mathematical models, Fourier series
Series Name:	IEEE INDUSTRY APPLICATIONS SOCIETY ANNUAL MEETING
Journal or Publication Title:	Industry Applications Society. IEEE - IAS Annual Meeting. Conference Record
Publisher:	IEEE
ISBN:	978-1-4244-2278-4
ISSN:	0197-2618
Date:	2008
Volume:	Vol.1-5
Number of Pages:	8
Page Range:	pp. 1457-1464
Identification Number:	10.1109/08IAS.2008.359
Status:	Not Peer Reviewed
Publication Status:	Published
Access rights to Published version:	Restricted or Subscription Access
Funder:	Toyota Jidōsha Kabushiki Kaisha
Title of Event:	IEEE Industry-Applications-Society Annual Meeting
Type of Event:	Conference
Location of Event:	Alberta, Canada
Date(s) of Event:	Oct 05-09, 2008
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URI:	http://wrap.warwick.ac.uk/id/eprint/28498

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