Ali, Syed Z., Udrea, Florin, Milne, W. I. (William I.) and Gardner, J. W. (Julian W.), 1958-. (2008) Tungsten-based SOI microhotplates for smart gas sensors. IEEE Journal of Microelectromechanical Systems, Vol.17 (No.6). pp. 1408-1417. ISSN 1057-7157

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Abstract

This paper is concerned with the design, fabrication, and characterization of novel high-temperature silicon on insulator (SOI) microhotplates employing tungsten resistive heaters. Tungsten has a high operating temperature and good mechanical strength and is used as an interconnect in high temperature SOI-CMOS processes. These devices have been fabricated using a commercial SOI-CMOS process followed by a deep reactive ion etching (DRIE) back-etch step, offering low cost and circuit integration. In this paper, we report on the design of microhotplates with different diameters (560 and 300 mu m) together with 3-D electrothermal simulation in ANSYS, electrothermal characterization, and analytical analysis. Results show that these devices can operate at high temperatures (600 degrees C) well beyond the typical junction temperatures of high temperature SOI ICs (225 degrees C), have ultralow do power consumption (12 mW at 600 degrees C), fast transient time (as low as 2-ms rise time to 600 degrees C), good thermal stability, and, more importantly, a high reproducibility both within a wafer and from wafer to wafer. We also report initial tests on the long-term stability of the tungsten heaters. We believe that this type of SOI microhotplate could be exploited commercially in fully integrated microcalorimetric or resistive gas sensors.

Item Type:	Journal Article
Subjects:	T Technology > TK Electrical engineering. Electronics Nuclear engineering T Technology > TJ Mechanical engineering and machinery
Divisions:	Faculty of Science > Engineering
Library of Congress Subject Headings (LCSH):	Gas detectors, Microelectromechanical systems, Metal oxide semiconductors, Complementary, Silicon-on-insulator technology, Tungsten -- Thermal properties
Journal or Publication Title:	IEEE Journal of Microelectromechanical Systems
Publisher:	Institute of Electrical and Electronics Engineers
ISSN:	1057-7157
Date:	December 2008
Volume:	Vol.17
Number:	No.6
Number of Pages:	10
Page Range:	pp. 1408-1417
Identification Number:	10.1109/JMEMS.2008.2007228
Status:	Peer Reviewed
Publication Status:	Published
Access rights to Published version:	Restricted or Subscription Access
Funder:	Engineering and Physical Sciences Research Council (EPSRC), Korea (South). Chŏngbo T'ongsinbu [Korea (South). Ministry of Information and Communication]
Grant number:	EP/F004931/1 (EPSRC), A1100-0602-0101 (MIC)
URI:	http://wrap.warwick.ac.uk/id/eprint/28829

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