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Ultrasonic weak bond evaluation in IC packaging
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UNSPECIFIED (2005) Ultrasonic weak bond evaluation in IC packaging. In: 3rd International Conference on Experimental Mechanics/3rd Conference of the Asian-Committee-on-Experimental-Mechanics, Singapore, SINGAPORE, NOV 29-DEC 01, 2004. Published in: Third International Conference on Experimental Mechanics and Third Conference of the Asian-Committee-on-Experimental-Mechanics, Pts 1and 2, 5852 (Part 1&2). pp. 528-533. ISBN 0-8194-5852-X. doi:10.1117/12.621561 ISSN 0277-786X.
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Official URL: http://dx.doi.org/10.1117/12.621561
Abstract
Air gap such as disbond and crack can be successfully detected by ultrasonic testing. But imperfect interface evaluation is still a challenge. The challenge arises from the uncertainty of formation mechanism, boundary condition and acoustical response. In the paper, samples of structure silicon/adhesive/lead-frame, typical in IC packaging, are fabricated with two adhesives, degraded through thermo cycling, examined by acoustical waveform and C-imaging, and compared to the measured optical microscopy image and the measured failure shear strength.
Item Type: | Conference Item (UNSPECIFIED) | ||||
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Subjects: | Q Science > QC Physics | ||||
Series Name: | PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE) | ||||
Journal or Publication Title: | Third International Conference on Experimental Mechanics and Third Conference of the Asian-Committee-on-Experimental-Mechanics, Pts 1and 2 | ||||
Publisher: | SPIE-INT SOC OPTICAL ENGINEERING | ||||
ISBN: | 0-8194-5852-X | ||||
ISSN: | 0277-786X | ||||
Editor: | Quan, C and Chau, FS and Asundi, A and Wong, BS and Lim, CT | ||||
Official Date: | 2005 | ||||
Dates: |
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Volume: | 5852 | ||||
Number: | Part 1&2 | ||||
Number of Pages: | 6 | ||||
Page Range: | pp. 528-533 | ||||
DOI: | 10.1117/12.621561 | ||||
Publication Status: | Published | ||||
Title of Event: | 3rd International Conference on Experimental Mechanics/3rd Conference of the Asian-Committee-on-Experimental-Mechanics | ||||
Location of Event: | Singapore, SINGAPORE | ||||
Date(s) of Event: | NOV 29-DEC 01, 2004 |
Data sourced from Thomson Reuters' Web of Knowledge
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