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Non-destructive thickness characterization of Si based heterostructure by X-ray diffraction and reflectivity

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Liu, Xue-Chao, Myronov, Maksym, Dobbie, A. (Andrew), Nguyen, Van H. and Leadley, D. R. (David R.) (2011) Non-destructive thickness characterization of Si based heterostructure by X-ray diffraction and reflectivity. Solid-State Electronics, Vol.60 (No.1). pp. 42-45. doi:10.1016/j.sse.2011.01.036 ISSN 0038-1101.

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Official URL: http://dx.doi.org/10.1016/j.sse.2011.01.036

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Abstract

High-resolution X-ray diffraction rocking curve (RC) and X-ray reflectivity (XRR) were used to characterize the Si based heterostructures grown by reduced pressure chemical vapour deposition. The investigation focused on the reliability and accuracy of thickness measurement by the different techniques. For smooth Si epilayers grown on a thin (20 nm) strained Si0.9Ge0.1 buffer, it is found that both XRR and RC produce reliable values that agree well with transmission electron microscope (TEM) results over a wide range. The best-fit thickness from both XRR and RC is within +/- 5% of the TEM measurement, with XRR producing more accurate values than RC. However, the agreement is not good for Si epilayer grown on a thick (2 mu m) relaxed Si07Ge0.3 virtual substrate due to the presence of rough surface. (C) 2011 Elsevier Ltd. All rights reserved.

Item Type: Journal Article
Subjects: Q Science > QC Physics
Divisions: Faculty of Science, Engineering and Medicine > Science > Physics
Journal or Publication Title: Solid-State Electronics
Publisher: Elsevier
ISSN: 0038-1101
Official Date: June 2011
Dates:
DateEvent
June 2011Published
Volume: Vol.60
Number: No.1
Page Range: pp. 42-45
DOI: 10.1016/j.sse.2011.01.036
Status: Peer Reviewed
Reuse Statement (publisher, data, author rights): International SiGe Technology and Device Meeting (ISTDM), Kista, SWEDEN, MAY 24-26, 2010
Access rights to Published version: Restricted or Subscription Access
Funder: Engineering and Physical Sciences Research Council (EPSRC)
Grant number: EP/E065317/1 (EPSRC), EP/F031408/1 (EPSRC)

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