
The Library
Microstructural studies of PZT thick films on Cu foils
Tools
Wu, A., Vilarinho, P., Srinivasan, S., Kingon, Angus I., Reaney, Ian M., Woodward, David I., Ramos, A. and Alves, E. (2006) Microstructural studies of PZT thick films on Cu foils. Acta Materialia, Vol.54 (No.12). pp. 3211-3220. doi:10.1016/j.actamat.2006.03.006 ISSN 13596454.
Research output not available from this repository.
Request-a-Copy directly from author or use local Library Get it For Me service.
Official URL: http://dx.doi.org/10.1016/j.actamat.2006.03.006
Abstract
This paper explains the limits of processing conditions for Pb(Zr, Ti)O3 (PZT) thick films on Cu substrates. PZT thick films in the thickness range 5–20 μm deposited on flexible Cu foils by electrophoretic deposition showed poorer properties when compared with PZT thick films deposited on Pt foils under identical conditions. Although the density of the sintered films and the electrical properties were improved by introducing a PbO coating on the top of the films, the dielectric and ferroelectric properties of PZT thick films on Cu were still inferior to those of films deposited on Pt. Rutherford backscattering spectrometry, X-ray diffraction and transmission electron microscopy revealed the formation of a Cux–Pb alloy when sintering above 950 °C, accompanied by Ti enrichment of the PZT and the formation of ZrO2 phases. As the sintering temperature increased, the concentration of the metallic phase increased and spread throughout the film. A new Pb–Cu alloy phase was identified. The poorer electrical properties of PZT thick films on Cu were correlated with these microstructural features.
Item Type: | Journal Article | ||||
---|---|---|---|---|---|
Subjects: | Q Science > QC Physics Q Science > QD Chemistry Q Science > QE Geology T Technology > TK Electrical engineering. Electronics Nuclear engineering |
||||
Divisions: | Faculty of Science, Engineering and Medicine > Science > Physics | ||||
Library of Congress Subject Headings (LCSH): | Microstructure, Perovskite, Thick films, Coatings, Copper, Electron microscopy | ||||
Journal or Publication Title: | Acta Materialia | ||||
Publisher: | Pergamon | ||||
ISSN: | 13596454 | ||||
Official Date: | 2006 | ||||
Dates: |
|
||||
Volume: | Vol.54 | ||||
Number: | No.12 | ||||
Page Range: | pp. 3211-3220 | ||||
DOI: | 10.1016/j.actamat.2006.03.006 | ||||
Status: | Peer Reviewed | ||||
Funder: | European Network of Excellence FAME | ||||
Grant number: | FP6-500159-1 |
Request changes or add full text files to a record
Repository staff actions (login required)
![]() |
View Item |