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Fractal growth of copper electrodeposits
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Brady, R. M. and Ball, R. C.. (1985) Fractal growth of copper electrodeposits. Journal of Statistical Physics, Vol.39 (No.1-2). p. 247. ISSN 0022-4715
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Official URL: http://dx.doi.org/10.1038/309225a0
| Item Type: | Journal Article |
|---|---|
| Subjects: | Q Science > QC Physics Q Science > QD Chemistry |
| Divisions: | Faculty of Science > Physics |
| Library of Congress Subject Headings (LCSH): | Electroforming, Copper plating, Copper -- Electrometallurgy, Aggregation (Chemistry) -- Computer simulation, Fractals |
| Journal or Publication Title: | Journal of Statistical Physics |
| Publisher: | Springer New York LLC |
| ISSN: | 0022-4715 |
| Date: | 1985 |
| Volume: | Vol.39 |
| Number: | No.1-2 |
| Page Range: | p. 247 |
| Identification Number: | 10.1038/309225a0 |
| Status: | Peer Reviewed |
| Publication Status: | Published |
| Description: | Abstract |
| Version or Related Resource: | Brady, R. M. and Ball, R. C. (1984). Fractal growth of copper electrodeposits. Nature, 309(5965), pp. 225-229. |
| Related URLs: | |
| URI: | http://wrap.warwick.ac.uk/id/eprint/39393 |
Data sourced from Thomson Reuters' Web of Knowledge
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