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Layered metal and highly doped MBE Si contacts for 4H-SiC power devices

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Jennings, M. R., Pérez-Tomás, Amador, Gammon, P. M., Davis, M., Chow, T. P. and Mawby, P. A. (Philip A.) (2008) Layered metal and highly doped MBE Si contacts for 4H-SiC power devices. In: 9th International Seminar on Power Semiconductors (ISPS 2008) , Prague, Czech Republic, Aug 27-29, 2008. Published in: IET Digest, Vol.2008 (No.2). pp. 69-72.

Full text not available from this repository.
Official URL: http://dx.doi.org/10.1049/ic:20080185

Abstract

This paper presents two contacting methods for 4H-SiC power devices: layered metal and highly doped molecular beam epitaxy (MBE) silicon (Si) contacts. Layered metallic contacts are based on nickel (Ni), aluminium (Al) and titanium (Ti), displaying low specific contact resistivities to p-type 4 H-SiC in the range of 10-4 -10-6 Omega cm2 . Ti based contacts display the lowest specific contact resistivity of 5.02 × 10-6 Omega cm2 . X-ray diffraction (XRD) scans point to enhanced silicide formation for Al-Ti(Ti3SiC2) and Al-Ni(NixSi) contacts that displayed ohmicity. The second contacting method presents the electrical and physical characteristics of highly doped MBE Si layers above 4H-SiC. This form of Si/SiC heterojunction contact presents significant SiC processing advantages for the semiconductor industry, eliminating high temperature annealing steps. Electrical measurements have been performed and highlight the Schottky-type rectifying properties displayed by Si/SiC heterojunctions. A scanning electron microscope (SEM) was employed to examine the surface morphology of the MBE Si layers. Smoother surfaces with less island formation have been correlated to low temperature (500°C) MBE Si growth.

Item Type: Conference Item (Paper)
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering
Divisions: Faculty of Science > Engineering
Journal or Publication Title: IET Digest
Publisher: Institute of Engineering Technology
Book Title: 9th International Seminar on Power Semiconductors (ISPS 2008)
Date: 2008
Volume: Vol.2008
Number: No.2
Page Range: pp. 69-72
Identification Number: 10.1049/ic:20080185
Status: Peer Reviewed
Publication Status: Published
Access rights to Published version: Restricted or Subscription Access
Conference Paper Type: Paper
Title of Event: 9th International Seminar on Power Semiconductors (ISPS 2008)
Type of Event: Other
Location of Event: Prague, Czech Republic
Date(s) of Event: Aug 27-29, 2008
URI: http://wrap.warwick.ac.uk/id/eprint/46260

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