Yue, Zhaoyang, Liu, Xianping, Cai, Z. and Cai, P. (2008) A multi-function tribological probe microscope with a hot tip for thermal measurement. In: Fifth International Symposium on Instrumentation Science and Technology, Shenyang, China, Sep 15-18, 2008. Published in: Proceedings of the Fifth International Symposium on Instrumentation Science and Technology, Vol.7133 Article: 71334L.

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Abstract

Surface mechanical and thermal properties objectively affect our touch-feel perception. However, it is still far from known that how the surface properties affect the stimulus to our nerve system and make us feel warm or cold, hard or soft, rough or smooth, etc. Physically, although the surface properties can be measured individually by different instruments, it is desirable to have a multifunctional instrument to facilitate the investigation of the relationship between the surface physical characteristics and the corresponding perceived touch feeling by human. In our previous work, a novel multi-functional tribological probe microscope (TPM) was developed to provide mappings of four functions of a surface at micro and nanometer scales. The four functions of surface topography, hardness, Young's modulus and friction are measured in a single scan set-up and they are potentially linked in space and time to provide cross-correlation in between. In this paper, to achieve the additional function of micro thermal analysis, we proposed a new scheme of thermal probe with a hot wire (Wollaston wire) buried beneath a Berkovich diamond indenter. The details of mechanical design and associated electronic circuits are presented. Meanwhile, the paper also explains the principle of the hot-tip technique by relating its signals to established physical parameters of materials, a method that separates sample information from the artifact caused by the indentation geometry of the diamond tip. Experimental results of thermal conductivity measurements on certain metal specimens are discussed.

Item Type:	Conference Item (Paper)
Subjects:	T Technology > TA Engineering (General). Civil engineering (General) T Technology > TJ Mechanical engineering and machinery
Divisions:	Faculty of Science > Engineering
Journal or Publication Title:	Proceedings of the Fifth International Symposium on Instrumentation Science and Technology
Publisher:	The International Society for Optics and Photonics
Book Title:	Proceedings of SPIE
Date:	2008
Volume:	Vol.7133
Page Range:	Article: 71334L
Identification Number:	10.1117/12.810479
Status:	Peer Reviewed
Publication Status:	Published
Access rights to Published version:	Restricted or Subscription Access
Conference Paper Type:	Paper
Title of Event:	Fifth International Symposium on Instrumentation Science and Technology
Type of Event:	Other
Location of Event:	Shenyang, China
Date(s) of Event:	Sep 15-18, 2008
URI:	http://wrap.warwick.ac.uk/id/eprint/46589

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