Skip to content Skip to navigation
University of Warwick
  • Study
  • |
  • Research
  • |
  • Business
  • |
  • Alumni
  • |
  • News
  • |
  • About

University of Warwick
Publications service & WRAP

Highlight your research

  • WRAP
    • Home
    • Search WRAP
    • Browse by Warwick Author
    • Browse WRAP by Year
    • Browse WRAP by Subject
    • Browse WRAP by Department
    • Browse WRAP by Funder
    • Browse Theses by Department
  • Publications Service
    • Home
    • Search Publications Service
    • Browse by Warwick Author
    • Browse Publications service by Year
    • Browse Publications service by Subject
    • Browse Publications service by Department
    • Browse Publications service by Funder
  • Help & Advice
University of Warwick

The Library

  • Login
  • Admin

Reliability of fine pitch Sn–3.8Ag–0.7Cu flip chip solder joints with different connection pads on PCB

Tools
- Tools
+ Tools

Li, D., Liu, Changqing and Conway, Paul P. (2008) Reliability of fine pitch Sn–3.8Ag–0.7Cu flip chip solder joints with different connection pads on PCB. Journal of Electronic Packaging, Vol.130 (No.1). Article: 011005. doi:10.1115/1.2837522

Research output not available from this repository, contact author.
Official URL: http://dx.doi.org/10.1115/1.2837522

Request Changes to record.

Abstract

The reliability of fine pitch Sn–3.8Ag–0.7Cu flip chip solder joints with three different pads, i.e., bare pads, pads with solder masks, and pads with microvia, on printed circuit boards (PCBs) was studied through thermal cycling. After assembly, (Au,Ni)Sn4 intermetallics (IMCs) formed both in the bulk solder and at the interfaces due to the immersion-Au finish on the PCB side. The (Au,Ni)Sn4 IMCs formed in the solder joints on the pads with microvia were more abundant than those formed in the solder joints on the pads without microvia. The results showed that the solder joints on the pads with a microvia had poor reliability due to the insufficient solder volume and the formation of large amounts of (Au,Ni)Sn4 IMCs. The main crack initiation position was the corner of solder joint at the chip side. For the pads with microvia, the main location of failure was at the (Au,Ni)Sn4/solder interface on the chip side, and for the solder joints on bare pads and pads with solder mask, the possible failure location was in the bulk solder.

Item Type: Journal Article
Subjects: T Technology > TA Engineering (General). Civil engineering (General)
T Technology > TN Mining engineering. Metallurgy
Divisions: Faculty of Science > WMG (Formerly the Warwick Manufacturing Group)
Journal or Publication Title: Journal of Electronic Packaging
Publisher: ASME International
ISSN: 1043-7398
Official Date: 31 January 2008
Dates:
DateEvent
31 January 2008Published
Volume: Vol.130
Number: No.1
Number of Pages: 7
Page Range: Article: 011005
DOI: 10.1115/1.2837522
Status: Peer Reviewed
Publication Status: Published
Access rights to Published version: Restricted or Subscription Access

Data sourced from Thomson Reuters' Web of Knowledge

Request changes or add full text files to a record

Repository staff actions (login required)

View Item View Item
twitter

Email us: wrap@warwick.ac.uk
Contact Details
About Us