Fast 3D thermal simulation of power module packaging
Swan, I. R. (Ian R.), Bryant, Angus T. and Mawby, P. A. (Philip A.). (2012) Fast 3D thermal simulation of power module packaging. International Journal of Numerical Modelling : Electronic Networks, Devices and Fields, Vol.25 (No.4). pp. 378-399. ISSN 0894-3370Full text not available from this repository.
Official URL: http://dx.doi.org/10.1002/jnm.841
This paper presents a thermal model that uses a Fourier series solution to the heat equation to carry out transient 3D thermal simulation of power device packaging. The development and implementation of this physics-based method is described. The method is demonstrated on a stacked 3D multichip module. The required aspects of 3D heat conduction are captured successfully by the model. Compared with previous thermal models presented in literature, it is fast, accurate and can be easily integrated with an inverter circuit simulator to model realistic converter load cycles. Copyright © 2012 John Wiley & Sons, Ltd.
|Item Type:||Journal Article|
|Subjects:||T Technology > TK Electrical engineering. Electronics Nuclear engineering|
|Divisions:||Faculty of Science > Engineering|
|Journal or Publication Title:||International Journal of Numerical Modelling : Electronic Networks, Devices and Fields|
|Publisher:||John Wiley & Sons Ltd.|
|Official Date:||July 2012|
|Page Range:||pp. 378-399|
|Access rights to Published version:||Restricted or Subscription Access|
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