Swan, I. R. (Ian R.), Bryant, Angus T. and Mawby, P. A. (Philip A.). (2012) Fast 3D thermal simulation of power module packaging. International Journal of Numerical Modelling : Electronic Networks, Devices and Fields, Vol.25 (No.4). pp. 378-399. ISSN 0894-3370

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Abstract

This paper presents a thermal model that uses a Fourier series solution to the heat equation to carry out transient 3D thermal simulation of power device packaging. The development and implementation of this physics-based method is described. The method is demonstrated on a stacked 3D multichip module. The required aspects of 3D heat conduction are captured successfully by the model. Compared with previous thermal models presented in literature, it is fast, accurate and can be easily integrated with an inverter circuit simulator to model realistic converter load cycles. Copyright © 2012 John Wiley & Sons, Ltd.

Item Type:	Journal Article
Subjects:	T Technology > TK Electrical engineering. Electronics Nuclear engineering
Divisions:	Faculty of Science > Engineering
Journal or Publication Title:	International Journal of Numerical Modelling : Electronic Networks, Devices and Fields
Publisher:	John Wiley & Sons Ltd.
ISSN:	0894-3370
Date:	July 2012
Volume:	Vol.25
Number:	No.4
Page Range:	pp. 378-399
Identification Number:	10.1002/jnm.841
Status:	Peer Reviewed
Publication Status:	Published
Access rights to Published version:	Restricted or Subscription Access
URI:	http://wrap.warwick.ac.uk/id/eprint/48280

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