Yue, Zhaoyang and Liu, Xianping (2010) A preliminary study of micro heat conduction by hot-tip tribological probe microscope. In: 9th International Symposium on Measurement Technology and Intelligent Instruments, St Petersburg, Russia, June 29-July 02, 2009. Published in: Key Engineering Materials, Vol.437 pp. 374-378.

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Abstract

Scanning thermal microscopy (SThM) and infrared thermography are widely used for surface thermal characterization. However, the SThM technique is limited by measurement of the non-electrical conductive surfaces and the infrared thermography has insufficient spatial resolution for submicron localized thermal measurement. The "hot tip" Tribological Probe Microscope (TPM) has been designed to achieve better localized thermal analysis function in this paper. The schemes of system design are presented and the principle of the 'hot-tip' technique is explained by relating the signals to established thermal properties. After calibrating the lumped thermal resistances (LTR) of the probe and the ambient environment, the LTRs of 5 metal surfaces were measured and compared. In addition, the paper numerically studied the LTR of the indentation interfaces with defined thermal conductivity (TC) by Finite Element Method (FEM). Numerical linearity was observed and fitted between LTR and TC. Based on the measured LTR and the linearity, the deduced TCs of the 5 metal surfaces are agreed well with the reference values.

Item Type:	Conference Item (UNSPECIFIED)
Subjects:	T Technology > TP Chemical technology T Technology > TA Engineering (General). Civil engineering (General)
Divisions:	Faculty of Science > Engineering
Series Name:	Key Engineering Materials
Journal or Publication Title:	Key Engineering Materials
Publisher:	Trans Tech Publications Ltd
ISBN:	*****************
ISSN:	1013-9826
Editor:	Chugui, Y and Gao, YS and Fan, KC and Taymanov, R and Sapozhnikova, K
Date:	2010
Volume:	Vol.437
Number of Pages:	5
Page Range:	pp. 374-378
Identification Number:	10.4028/www.scientific.net/KEM.437.374
Status:	Not Peer Reviewed
Publication Status:	Published
Title of Event:	9th International Symposium on Measurement Technology and Intelligent Instruments
Type of Event:	Conference
Location of Event:	St Petersburg, Russia
Date(s) of Event:	June 29-July 02, 2009
URI:	http://wrap.warwick.ac.uk/id/eprint/4879

Data sourced from Thomson Reuters' Web of Knowledge

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