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Condition monitoring power module solder fatigue using inverter harmonic identification
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Xiang, Dawei, Ran, Li, Tavner, Peter, Yang, Shaoyong, Bryant, Angus and Mawby, P. A. (Philip A.) (2012) Condition monitoring power module solder fatigue using inverter harmonic identification. IEEE Transactions on Power Electronics, Volume 27 (Number 1). pp. 235-247. doi:10.1109/TPEL.2011.2160988 ISSN 0885-8993.
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Official URL: http://dx.doi.org/10.1109/TPEL.2011.2160988
Abstract
Condition monitoring power semiconductor devices can inform converter maintenance and reduce damage. This paper presents a method to monitor solder fatigue in a voltage source inverter insulated gate bipolar transistor power module by detecting the change of an inverter output harmonic. It is shown that low-order harmonics, caused by nonideal switching, are affected by the device junction temperature, which in turn depends upon module solder condition. To improve the detection accuracy of the phenomenon, the inverter controller is set to cause harmonic resonance at the target harmonic frequency. The would-be resonance is suppressed by an outer control loop where the control action can be used as the condition monitoring signal. Simulation and experiment are presented to validate the method and evaluate its performance in operation.
Item Type: | Journal Article | ||||
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Divisions: | Faculty of Science, Engineering and Medicine > Engineering > Engineering | ||||
Journal or Publication Title: | IEEE Transactions on Power Electronics | ||||
Publisher: | IEEE | ||||
ISSN: | 0885-8993 | ||||
Official Date: | 2012 | ||||
Dates: |
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Volume: | Volume 27 | ||||
Number: | Number 1 | ||||
Page Range: | pp. 235-247 | ||||
DOI: | 10.1109/TPEL.2011.2160988 | ||||
Status: | Peer Reviewed | ||||
Publication Status: | Published | ||||
Access rights to Published version: | Restricted or Subscription Access |
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