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3-D thermal simulation of power module packaging
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Swan, I. R. (Ian R.), Bryant, A. T., Parker-Allotey, Nii-Adotei and Mawby, P. A. (Philip A.) (2009) 3-D thermal simulation of power module packaging. In: IEEE Energy Conversion Congress and Exposition, San Jose, CA, Sepbember 20-24, 2009. Published in: 2009 IEEE Energy Conversion Congress and Exposition, Vols. 1-6 pp. 1185-1192.
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Official URL: http://dx.doi.org/10.1109/ECCE.2009.5316235
Abstract
This paper describes the development and implementation of an analytical 3-D thermal model for fast and accurate thermal simulation of power device modules in electro-thermal converter simulation. A Fourier-based solution is used to solve the 3-D heat equation. The solution can describe the variation of temperature through the whole IPM structure with time. The model can simulate thermal interactions resulting from multiple heat sources. The thermal model is extremely fast to simulate compared to finite-element (FEM) approaches. The new model has been implemented in MATLAB/Simulink in order to co-simulate with the converter model which is in the same form. The model has been validated against the CFD software package FLOTHERM and shows good agreement. The required aspects of 3-D heat diffusion are captured successfully by the Fourier-based model.
| Item Type: | Conference Item (Paper) |
|---|---|
| Subjects: | T Technology > TJ Mechanical engineering and machinery T Technology > TK Electrical engineering. Electronics Nuclear engineering |
| Divisions: | Faculty of Science > Engineering |
| Journal or Publication Title: | 2009 IEEE Energy Conversion Congress and Exposition, Vols. 1-6 |
| Publisher: | IEEE |
| ISBN: | 978-1-4244-2892-2 |
| Date: | 2009 |
| Number of Pages: | 8 |
| Page Range: | pp. 1185-1192 |
| Identification Number: | 10.1109/ECCE.2009.5316235 |
| Status: | Peer Reviewed |
| Publication Status: | Published |
| Access rights to Published version: | Restricted or Subscription Access |
| Conference Paper Type: | Paper |
| Title of Event: | IEEE Energy Conversion Congress and Exposition |
| Type of Event: | Conference |
| Location of Event: | San Jose, CA |
| Date(s) of Event: | Sepbember 20-24, 2009 |
| URI: | http://wrap.warwick.ac.uk/id/eprint/5536 |
Data sourced from Thomson Reuters' Web of Knowledge
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