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Thermal studies of a plate bundle waveguide for use as an ultrasonic flow meter buffer

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Laws, Michael R., Ramadas, Sivaram Nishal and Dixon, S. (2013) Thermal studies of a plate bundle waveguide for use as an ultrasonic flow meter buffer. In: 2013 IEEE International Ultrasonics Symposium (IUS), Prague, Czech Republic, 21-25 Jul 2013 pp. 1618-1621. ISBN 9781467356848. doi:10.1109/ULTSYM.2013.0412

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Official URL: http://dx.doi.org/10.1109/ULTSYM.2013.0412

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Abstract

The thermal properties of a buffer waveguide, for use in flow measurement, have been studied, through the use of modeling and experimentally. We have observed the effects of thermal gradients within the device, particularly on the velocity of the propagating wave modes. Additionally, we have investigated the effects of geometry on cross talk, heat dissipation and attenuation of reverberations within the device.

Item Type: Conference Item (Paper)
Divisions: Faculty of Science, Engineering and Medicine > Science > Physics
Publisher: IEEE Computer Society
ISBN: 9781467356848
Book Title: 2013 IEEE International Ultrasonics Symposium (IUS)
Official Date: 2013
Dates:
DateEvent
2013UNSPECIFIED
Page Range: pp. 1618-1621
DOI: 10.1109/ULTSYM.2013.0412
Status: Peer Reviewed
Publication Status: Published
Access rights to Published version: Restricted or Subscription Access
Conference Paper Type: Paper
Title of Event: 2013 IEEE International Ultrasonics Symposium (IUS)
Type of Event: Conference
Location of Event: Prague, Czech Republic
Date(s) of Event: 21-25 Jul 2013

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