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Thermal studies of a plate bundle waveguide for use as an ultrasonic flow meter buffer
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Laws, Michael R., Ramadas, Sivaram Nishal and Dixon, S. (2013) Thermal studies of a plate bundle waveguide for use as an ultrasonic flow meter buffer. In: 2013 IEEE International Ultrasonics Symposium (IUS), Prague, Czech Republic, 21-25 Jul 2013 pp. 1618-1621. ISBN 9781467356848. doi:10.1109/ULTSYM.2013.0412
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Official URL: http://dx.doi.org/10.1109/ULTSYM.2013.0412
Abstract
The thermal properties of a buffer waveguide, for use in flow measurement, have been studied, through the use of modeling and experimentally. We have observed the effects of thermal gradients within the device, particularly on the velocity of the propagating wave modes. Additionally, we have investigated the effects of geometry on cross talk, heat dissipation and attenuation of reverberations within the device.
| Item Type: | Conference Item (Paper) | ||||
|---|---|---|---|---|---|
| Divisions: | Faculty of Science > Physics | ||||
| Publisher: | IEEE Computer Society | ||||
| ISBN: | 9781467356848 | ||||
| Book Title: | 2013 IEEE International Ultrasonics Symposium (IUS) | ||||
| Official Date: | 2013 | ||||
| Dates: |
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| Page Range: | pp. 1618-1621 | ||||
| DOI: | 10.1109/ULTSYM.2013.0412 | ||||
| Status: | Peer Reviewed | ||||
| Publication Status: | Published | ||||
| Access rights to Published version: | Restricted or Subscription Access | ||||
| Conference Paper Type: | Paper | ||||
| Title of Event: | 2013 IEEE International Ultrasonics Symposium (IUS) | ||||
| Type of Event: | Conference | ||||
| Location of Event: | Prague, Czech Republic | ||||
| Date(s) of Event: | 21-25 Jul 2013 |
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