Li, C., Ahearne, Mark and Liu, Kuo-Kang. (2010) Micromechanical characterization of hydrogel-based contact lens. International Journal of Modern Physics B (IJMPB), Vol.24 (No.1-2). pp. 117-127. ISSN 0217-9792

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Abstract

A new micro-shaft-poking (MSP) apparatus has been applied for characterizing the mechanical properties of hydrogel-based contact lens. The instrument allows measurement of the force-displacement curve of the contact lens under a wide range of strain and strain rate. The materials display hysteresis and stress relaxation (50-60%) manifested in the experimental compliance curves. In parallel, a Finite Element Analysis (FEA) modeling incorporated with nonlinear elasticity has been performed for simulating the contact lens under large deformation. Through comparison between the simulated results and experimental data, the mechanical properties, e.g., stiffness, of the lens can be quantitatively determined. The viscoelastic characteristic of the lens has also been parametric fitted based on a five-parameter quasi-viscoelastic model.

Item Type:	Journal Article
Subjects:	R Medicine > RE Ophthalmology T Technology > TA Engineering (General). Civil engineering (General) T Technology > TK Electrical engineering. Electronics Nuclear engineering
Divisions:	Faculty of Science > Engineering
Library of Congress Subject Headings (LCSH):	Colloids -- Mechanical properties, Microelectromechanical systems, Contact lenses, Finite element method , Deformations (Mechanics), Viscoelasticity
Journal or Publication Title:	International Journal of Modern Physics B (IJMPB)
Publisher:	World Scientific Publishing Co. Pte. Ltd.
ISSN:	0217-9792
Date:	20 January 2010
Volume:	Vol.24
Number:	No.1-2
Number of Pages:	11
Page Range:	pp. 117-127
Identification Number:	10.1142/S0217979210064046
Status:	Peer Reviewed
Publication Status:	Published
Access rights to Published version:	Restricted or Subscription Access
Version or Related Resource:	This item was also presented at the Symposium on Mechanical Behavior of Micro- and Nano-Scale System held at the ICMAT 2009, Singapore, Jun 28 - Jul 3, 2009.
Title of Event:	Symposium on Mechanical Behavior of Micro- and Nano-Scale System held at the ICMAT 2009
Location of Event:	Singapore
Date(s) of Event:	June 28-July 03, 2009
URI:	http://wrap.warwick.ac.uk/id/eprint/6422

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