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Numerical issues in mold filling simulations of liquid composites processing

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Modi, D., Simacek, P. and Advani, S. (2002) Numerical issues in mold filling simulations of liquid composites processing. In: 10th U.S.-Japan Conference on Composite Materials, Stanford University, USA, 16-18 Sep 2002. Published in: Proceedings of the 10th U.S.-Japan Conference on Composite Materials ISBN 9781932078138.

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Item Type: Conference Item (Paper)
Divisions: Faculty of Science > WMG (Formerly the Warwick Manufacturing Group)
Journal or Publication Title: Proceedings of the 10th U.S.-Japan Conference on Composite Materials
Publisher: Destech Publications
ISBN: 9781932078138
Official Date: 30 June 2002
Dates:
DateEvent
30 June 2002Published
Status: Peer Reviewed
Publication Status: Published
Access rights to Published version: Restricted or Subscription Access
Conference Paper Type: Paper
Title of Event: 10th U.S.-Japan Conference on Composite Materials
Type of Event: Conference
Location of Event: Stanford University, USA
Date(s) of Event: 16-18 Sep 2002
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