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Low ΔTj stress cycle effects in IGBT power module die-attach lifetime modelling
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Lai, Wei, Chen, Mingyou, Ran, Li, Alatise, Olayiwola M., Xu, Shengyou and Mawby, P. A. (Philip A.) (2016) Low ΔTj stress cycle effects in IGBT power module die-attach lifetime modelling. IEEE Transactions on Power Electronics, 31 (9). pp. 6575-6585. doi:10.1109/TPEL.2015.2501540
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Official URL: http://dx.doi.org/10.1109/TPEL.2015.2501540
Abstract
Operational management for reliability of power electronic converters requires sensitive condition monitoring and accurate lifetime modeling. This study adds to the second aspect by examining the effect of cyclic junction temperature variations (ΔTj) of low amplitude in different stages of the power module ageing process. It is found that such relatively minor stress cycles, which happen frequently during normal operation, may not be able to directly initiate a crack but can contribute to the development of damage due to stress concentration. This agrees with the observation that the ageing process tends to accelerate towards the end of life. The study investigates the dependency of the ageing effect on the amplitude of ΔTj, the mean junction temperature Tm and the present health condition of the module, and proposes a lifetime model focusing on die-attach solder fatigue. It is assumed that the future ageing process is independent of the operational history that has led to the current state of health. The model is intended for operational management of converter systems that are subject to frequent low ΔTj stress cycles and are supposed to be in service reliably for a long time with a slow ageing process. Experimental results validate the model.
| Item Type: | Journal Article | ||||||||
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| Divisions: | Faculty of Science > Engineering | ||||||||
| Journal or Publication Title: | IEEE Transactions on Power Electronics | ||||||||
| Publisher: | IEEE | ||||||||
| ISSN: | 0885-8993 | ||||||||
| Official Date: | September 2016 | ||||||||
| Dates: |
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| Volume: | 31 | ||||||||
| Number: | 9 | ||||||||
| Page Range: | pp. 6575-6585 | ||||||||
| DOI: | 10.1109/TPEL.2015.2501540 | ||||||||
| Status: | Peer Reviewed | ||||||||
| Publication Status: | Published | ||||||||
| Access rights to Published version: | Restricted or Subscription Access | ||||||||
| Copyright Holders: | IEEE | ||||||||
| Funder: | Engineering and Physical Sciences Research Council (EPSRC) | ||||||||
| Grant number: | EP/K034804/1 |
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