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Evaluation of commercially available SiC devices and packaging materials for operation up to 350°C

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Hamilton, Dean P., Jennings, M. R. (Michael R.), Sharma, Yogesh K., Fisher, Craig A., Alatise, Olayiwola M. and Mawby, P. A. (Philip A.) (2014) Evaluation of commercially available SiC devices and packaging materials for operation up to 350°C. In: Energy Conversion Congress and Exposition (ECCE), 2014 IEEE, Pittsburgh, PA, 14-18 Sep 2014. Published in: 2014 IEEE Energy Conversion Congress and Exposition (ECCE) pp. 4381-4387. doi:10.1109/ECCE.2014.6953720

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Official URL: http://dx.doi.org/10.1109/ECCE.2014.6953720

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Abstract

The characteristics of commercially available silicon carbide power devices and packaging technologies have been measured up to 350°C in order to obtain their reliability and suitability for use in a hybrid electric vehicle application. Electro-thermal simulations of representative power module packaging structures, using measured conduction losses, revealed the respective temperature profiles of the devices and packaging. By correlating lifetime data found from our passive thermal cycling of candidate packaging technologies, with the magnitude and number of thermal cycles extracted from simulated temperature profiles, the lifetime of high temperature power module packages has been predicted. It was found that the limiting factor for high temperature thermal cycled operation is the silicon nitride substrate material, followed closely by the pressure-less silver sinter die attach. In this case, no aluminum wirebond failures were observed.

Item Type: Conference Item (Lecture)
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering
Divisions: Faculty of Science > Engineering
Journal or Publication Title: 2014 IEEE Energy Conversion Congress and Exposition (ECCE)
Publisher: IEEE
Official Date: 2014
Dates:
DateEvent
2014Published
Page Range: pp. 4381-4387
DOI: 10.1109/ECCE.2014.6953720
Status: Peer Reviewed
Publication Status: Published
Conference Paper Type: Lecture
Title of Event: Energy Conversion Congress and Exposition (ECCE), 2014 IEEE
Type of Event: Conference
Location of Event: Pittsburgh, PA
Date(s) of Event: 14-18 Sep 2014

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