The Library
Experimental investigations on the effects of narrow junction temperature cycles on die-attach solder layer in an IGBT module
Tools
Tools
Tools
Lai, Wei, Chen, Mingyou, Ran, Li, Xu, Shengyou, Jiang, Nan, Wang, Xuemei, Alatise, Olayiwola M. and Mawby, P. A. (2017) Experimental investigations on the effects of narrow junction temperature cycles on die-attach solder layer in an IGBT module. IEEE Transactions on Power Electronics, 32 (2). pp. 1431-1441. doi:10.1109/TPEL.2016.2546944
Research output not available from this repository, contact author.
Official URL: http://dx.doi.org/10.1109/TPEL.2016.2546944
Abstract
This paper presents a series of experiment results on the ageing effects of cyclic junction temperature variations (ΔTj) of low amplitudes in power modules, to help the capturing of module reliability characteristics and the derivation of lifetime models in the future. Power cycling tests, for non-aged and aged modules, are designed to illustrate the failure mechanisms. IGBT modules in actual converters are usually operated in a ΔTj range up to 40degC, therefore tests are carried out to observe the effects of such narrow ΔTj stress cycles on the module lifetime. It is found that the relatively minor stress cycles may not be able to directly initiate a crack but can contribute to the development of damage in the die attach solder layer due to stress concentration. FEA modeling is utilized to verify the stress concentration effect. The experiment results show that the effects of the narrow ΔTj stress cycles are affected by the ageing status of the module and the stress level itself.
| Item Type: | Journal Article | ||||||
|---|---|---|---|---|---|---|---|
| Alternative Title: | |||||||
| Subjects: | T Technology > TK Electrical engineering. Electronics Nuclear engineering | ||||||
| Divisions: | Faculty of Science > Engineering | ||||||
| Journal or Publication Title: | IEEE Transactions on Power Electronics | ||||||
| Publisher: | IEEE | ||||||
| ISSN: | 0885-8993 | ||||||
| Official Date: | February 2017 | ||||||
| Dates: |
|
||||||
| Date of first compliant deposit: | 26 March 2016 | ||||||
| Volume: | 32 | ||||||
| Number: | 2 | ||||||
| Page Range: | pp. 1431-1441 | ||||||
| DOI: | 10.1109/TPEL.2016.2546944 | ||||||
| Status: | Peer Reviewed | ||||||
| Publication Status: | Published | ||||||
| Access rights to Published version: | Restricted or Subscription Access | ||||||
| Copyright Holders: | IEEE | ||||||
| Grant number: | EP/K034804/1 |
Request changes or add full text files to a record
Repository staff actions (login required)
 |
View Item |
