Ortiz Gonzalez, Jose Angel, Ran, Li, Mohamed Motalab Ali Soli, A., Davletzhanova, Zarina, Alatise, Olayiwola M., Mawby, P. A. (Philip A.), Borong, Hu, Zheng, Zeng, Hai, Ren, Li, Hui and Shengyou, Xu (2016) Enabling high reliability power modules : a multidisciplinary task. In: International Symposium on 3D Power Electronics Integration and Manufacturing, McKimmon Center, Raleigh, NC, USA, 13-15 June 2016 ISBN 9781509029402.

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Abstract

Reliability of power electronic systems is a major concern for application engineers in the automotive and power system sectors. Power electronic modules are one of the main sources of failure in wind energy conversion systems. Power electronic converters used in wind turbine electric drive trains, railway traction, more-electric-aircrafts, marine propulsion and grid connected systems like FACTS/HVDC require reliable power devices and modules. Wide bandgap semiconductors like SiC have demonstrated enlarged electrothermal Safe-Operating-Areas compared with silicon devices. However, the reliability of SiC power modules and packages has been identified as an area of potential weakness. Traditional packaging systems have been developed for Si hence the different thermomechanical properties of SiC cause different stresses in the packaging thereby potentially causing reduced reliability. This paper identifies some of the key areas for the development of reliable power electronic systems using SiC. The focus is on condition monitoring, packaging system innovation and thermomechanical stress analysis as a function of the mechanical properties of Si and SiC. Power cycling experiments and finite element models have been used to support the analysis.

Item Type:	Conference Item (Other)
Subjects:	Q Science > QC Physics T Technology > TK Electrical engineering. Electronics Nuclear engineering
Divisions:	Faculty of Science > Engineering
Library of Congress Subject Headings (LCSH):	Electric current converters, Wide gap semiconductors , Power electronics, Wind turbines, Motorboats -- Motors, Locomotives -- Traction
ISBN:	9781509029402
Official Date:	19 September 2016
Dates:	Date Event 19 September 2016 Available 6 June 2016 Accepted
Date of first compliant deposit:	26 January 2017
Status:	Peer Reviewed
Publication Status:	Published
Funder:	Engineering and Physical Sciences Research Council (EPSRC), Guo jia zi ran ke xue ji jin wei yuan hui (China) [National Natural Science Foundation of China] (NSFC)
Grant number:	EP/K036327/1, EP/K034804/1 (EPSRC), Grant numbers 51377184 (NSFC)
Conference Paper Type:	Other
Title of Event:	International Symposium on 3D Power Electronics Integration and Manufacturing
Type of Event:	Conference
Location of Event:	McKimmon Center, Raleigh, NC, USA
Date(s) of Event:	13-15 June 2016

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