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Humidity buildup in electronic enclosures exposed to constant conditions
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Conseil-Gudla, H., Staliulionis, Z., Jellesen, M. S., Jabbari, M., Hattel, J. H. and Ambat, R. (2017) Humidity buildup in electronic enclosures exposed to constant conditions. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (3). pp. 412-423. doi:10.1109/TCPMT.2017.2655447 ISSN 2156-3950.
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Official URL: http://dx.doi.org/10.1109/TCPMT.2017.2655447
Abstract
Electronic components and devices are exposed to a wide variety of climatic conditions, therefore the protection of electronic devices from humidity is becoming a critical factor in the system design. The ingress of moisture into typical electronic enclosures has been studied with defined parameters such as openings in the enclosure (drain holes, intentional openings or leak) and sealing and casing material. Related corrosion reliability issues due to humidity buildup have been evaluated using an interdigitated surface insulation resistance pattern placed inside the enclosure during exposure. The moisture buildup inside the enclosure has been simulated using an equivalent RC circuit consisting of variables like controlled resistors and capacitors to describe the diffusivity, permeability, and storage in polymers.
Item Type: | Journal Article | ||||||||
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Divisions: | Faculty of Science, Engineering and Medicine > Engineering > WMG (Formerly the Warwick Manufacturing Group) | ||||||||
Journal or Publication Title: | IEEE Transactions on Components, Packaging and Manufacturing Technology | ||||||||
Publisher: | Institute of Electrical and Electronics Engineers | ||||||||
ISSN: | 2156-3950 | ||||||||
Official Date: | 13 February 2017 | ||||||||
Dates: |
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Volume: | 7 | ||||||||
Number: | 3 | ||||||||
Page Range: | pp. 412-423 | ||||||||
DOI: | 10.1109/TCPMT.2017.2655447 | ||||||||
Status: | Peer Reviewed | ||||||||
Publication Status: | Published | ||||||||
Access rights to Published version: | Restricted or Subscription Access |
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