High-resolution, air-coupled ultrasonic imaging of thin materials
UNSPECIFIED. (2003) High-resolution, air-coupled ultrasonic imaging of thin materials. IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, 50 (11). pp. 1516-1524. ISSN 0885-3010Full text not available from this repository.
This paper describes the use of a focused air-coupled capacitance transducer combined with pulse compression techniques to form high-resolution images of thin materials in air. The focusing of the device is achieved by using an off axis parabolic mirror. The lateral resolution of the focused transducer, operating over a bandwidth of 1.2 MHz, was found to be less than 0.5 mm. A combination of the focused transducer as a source and a planar receiver in through-transmission mode has been developed for the measurement of different features in paper products, with a lateral resolution in through-transmission imaging of similar to0.4 mm. Images in air of thin samples such as bank notes, high-quality writing paper, stamps, and sealed joints were obtained without contact to the sample.
|Item Type:||Journal Article|
|Subjects:||T Technology > TA Engineering (General). Civil engineering (General)
T Technology > TK Electrical engineering. Electronics Nuclear engineering
|Journal or Publication Title:||IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL|
|Publisher:||IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC|
|Official Date:||November 2003|
|Number of Pages:||9|
|Page Range:||pp. 1516-1524|
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