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Development of a high speed and precision wire clamp with both position and force regulations
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Liang, Cunman, Wang, Fujun, Tian, Yanling, Zhao, Xingyu and Zhang, Dawei (2017) Development of a high speed and precision wire clamp with both position and force regulations. Robotics and Computer-Integrated Manufacturing, 44 . pp. 208-217. doi:10.1016/j.rcim.2016.09.006 ISSN 0736-5845.
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WRAP-development-high-speed-precision-clamp-Tian-2017.pdf - Accepted Version - Requires a PDF viewer. Available under License Creative Commons Attribution Non-commercial No Derivatives 4.0. Download (1451Kb) | Preview |
Official URL: http://dx.doi.org/10.1016/j.rcim.2016.09.006
Abstract
This paper presents the mechanism and robust control of a monolithic wire clamp to achieve fast and precision operations for strong and robust micro device packaging. The wire clamp is piezoelectrically actuated and a two-stage flexure-based amplification was designed to obtain large and parallel jaw displacements. The grasping forces of the wire clamp were evaluated based on finite element analysis (FEA), and the force measurement was presented. The wire clamp was manufactured using wire EDM technique and the position and force transfer functions were obtained based on the frequency response approach. The position/force switching control strategy was employed to regulate the motion position and grasping force, and the position/force switching controller composed of a PID controller for position control and a sliding model controller (SMC) for force control was designed. Experimental tests were carried out to investigate the performance of wire clamp with the position/force switching controller during the grasping and releasing operations. The results show that the wire clamp exhibits good performance and demonstrate that high speed and precision grasping operations can be realized through the developed wire clamp and the control strategy.
Item Type: | Journal Article | ||||||||
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Subjects: | T Technology > TK Electrical engineering. Electronics Nuclear engineering | ||||||||
Divisions: | Faculty of Science, Engineering and Medicine > Engineering > Engineering | ||||||||
Library of Congress Subject Headings (LCSH): | Wire bonding (Electronic packaging) , Microelectronic packaging | ||||||||
Journal or Publication Title: | Robotics and Computer-Integrated Manufacturing | ||||||||
Publisher: | Elsevier | ||||||||
ISSN: | 0736-5845 | ||||||||
Official Date: | April 2017 | ||||||||
Dates: |
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Volume: | 44 | ||||||||
Page Range: | pp. 208-217 | ||||||||
DOI: | 10.1016/j.rcim.2016.09.006 | ||||||||
Status: | Peer Reviewed | ||||||||
Publication Status: | Published | ||||||||
Access rights to Published version: | Restricted or Subscription Access | ||||||||
Date of first compliant deposit: | 2 November 2017 | ||||||||
Date of first compliant Open Access: | 2 November 2017 | ||||||||
Funder: | Guo jia zi ran ke xue ji jin wei yuan hui (China) [National Natural Science Foundation of China] (NSFC), China. Tianjin shì kēxué jìshù wěiyuánhuì [Tianjin Science and Technology Committee] (STCT), Tianjin da xue | ||||||||
Grant number: | 51205279, 51275337, 51175372 (NSFC), 13JCQNJC04100, 15JCYBJC19600 (STCT), Grant no. 60301014 (Tianjin da xue) |
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