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Cost effective reprocessing of polyurethane by hot compression moulding

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UNSPECIFIED (2003) Cost effective reprocessing of polyurethane by hot compression moulding. In: 9th International Manufacturing Conference, AUG 16-17, 2000, HONG KONG, PEOPLES R CHINA.

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Official URL: http://dx.doi.org/10.1016/S0924-0136(03)00548-X

Abstract

Impending legislation and increasing landfill tax will mean that afar greater proportion of thermosetting polymers will have to be recycled. This paper investigates a method for the mechanical recycling of thermoset polyurethane. Reaction injection moulded (RIM) polyurethane (PU) was granulated and introduced as filler in novel moulding compounds. The polyurethane recyclate granules were compounded with polyester resin for compression moulding. A variety of different materials were moulded to demonstrate the recycling possibilities, these included non-reinforced filled thermoset, glass fibre reinforced compounds and sandwich materials with a core containing recyclate. Mechanical testing of the materials showed that the addition of polyurethane recyclate increased flexibility and toughness of the mouldings, when compared with compounds containing mineral fillers. The increased toughness is explained by the microstructure, the PU granules rubber toughen the resin by allowing micro-cracking of the thermoset resin matrix without brittle failure. Recycled polyurethane particles can be used as functional filler in thermoset-moulding compounds to improve the impact toughness of normally brittle materials. (C) 2003 Elsevier Science B.V. All rights reserved.

Item Type: Conference Item (UNSPECIFIED)
Subjects: T Technology
T Technology > TS Manufactures
T Technology > TA Engineering (General). Civil engineering (General)
Journal or Publication Title: JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
Publisher: ELSEVIER SCIENCE SA
ISSN: 0924-0136
Date: 20 August 2003
Volume: 139
Number: 1-3
Number of Pages: 5
Page Range: pp. 322-326
Publication Status: Published
Title of Event: 9th International Manufacturing Conference
Location of Event: HONG KONG, PEOPLES R CHINA
Date(s) of Event: AUG 16-17, 2000
URI: http://wrap.warwick.ac.uk/id/eprint/9483

Data sourced from Thomson Reuters' Web of Knowledge

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