The Library
Impact of temperature imbalance on junction temperature identification for multiple chip modules using TSEPs
Tools
Tools
Tools
Ortiz Gonzalez, Jose Angel, Alatise, Olayiwola M., Ran, Li and Mawby, P. A. (2017) Impact of temperature imbalance on junction temperature identification for multiple chip modules using TSEPs. In: PCIM Europe 2017; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nürnberg, Deutschland, 16-18 May 2017 . Published in: Proceedings of PCIM Europe 2017; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management ISBN 9783800744244.
![[img]](http://wrap.warwick.ac.uk/style/images/fileicons/application_pdf.png) |
PDF
WRAP-impact-temperature-imbalance-junction-temperature-Ortiz-Gonzalez-2017.pdf - Accepted Version Embargoed item. Restricted access to Repository staff only - Requires a PDF viewer. Download (2141Kb) |
Official URL: http://ieeexplore.ieee.org/abstract/document/79907...
Abstract
Junction temperature sensing using Temperature Sensitive Electrical Parameters (TSEPs), like the forward voltage at low currents, is a technique widely used for identifying the degradation of the thermal impedance during power cycling tests. SiC devices are now widely commercially available, however, there are two factors which characterize the use of TSEPs for temperature sensing in SiC, namely (i) a smaller chip size, which requires multiple parallel chips for enabling higher current modules and (ii) a reduced temperature sensitivity due to the wide bandgap characteristics. Moreover, since parallel connected chips may not degrade uniformly, junction temperature variation can result in parallel chips with different junction-to-case thermal resistances. In this case, assuming an average junction temperature for the paralleled chips can give erroneous estimations depending on the magnitude of the junction temperature difference. When there is low temperature imbalance between the parallel devices, the global TSEP is an accurate indicator, however, as the temperature imbalance increases, it underestimates the temperature of the hotter device.
| Item Type: | Conference Item (Paper) | ||||||
|---|---|---|---|---|---|---|---|
| Divisions: | Faculty of Science > Engineering | ||||||
| Journal or Publication Title: | Proceedings of PCIM Europe 2017; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management | ||||||
| Publisher: | VDE | ||||||
| ISBN: | 9783800744244 | ||||||
| Official Date: | 27 July 2017 | ||||||
| Dates: |
|
||||||
| Date of first compliant deposit: | 11 January 2018 | ||||||
| Status: | Peer Reviewed | ||||||
| Publication Status: | Published | ||||||
| Access rights to Published version: | Restricted or Subscription Access | ||||||
| Conference Paper Type: | Paper | ||||||
| Title of Event: | PCIM Europe 2017; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management | ||||||
| Type of Event: | Conference | ||||||
| Location of Event: | Nürnberg, Deutschland | ||||||
| Date(s) of Event: | 16-18 May 2017 | ||||||
| Related URLs: |
Request changes or add full text files to a record
Repository staff actions (login required)
 |
View Item |
