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Fast thermal models for power device packaging
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Swan, I. R. (Ian R.), Bryant, Angus T. and Mawby, P. A. (Philip A.) (2008) Fast thermal models for power device packaging. In: IEEE Industry-Applications-Society Annual Meeting, Alberta, Canada, Oct 05-09, 2008. Published in: Industry Applications Society. IEEE - IAS Annual Meeting. Conference Record, Vol.1-5 pp. 1457-1464. ISBN 978-1-4244-2278-4. doi:10.1109/08IAS.2008.359 ISSN 0197-2618.
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Official URL: http://dx.doi.org/10.1109/08IAS.2008.359
Abstract
This paper describes the development and implementation of an analytical thermal model for fast and accurate thermal simulations of power device modules. A Fourier-based solution is used to solve the heat equation in two dimensions. The solution can describe the variation of temperature through the structure versus time. The thermal model is extremely fast to simulate compared to finite-element (FEM) approaches. The new model has been implemented in MATLAB/Simulink. The model has been validated against FEM simulations and the difference between the two models has been illustrated. The required aspects of heat diffusion are captured successfully by the Fourier-based model.
Item Type: | Conference Item (UNSPECIFIED) | ||||
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Subjects: | T Technology > TK Electrical engineering. Electronics Nuclear engineering | ||||
Divisions: | Faculty of Science, Engineering and Medicine > Engineering > Engineering | ||||
Library of Congress Subject Headings (LCSH): | Electric current converters -- Computer simulation, Electric current converters -- Thermal properties, Heat -- Conduction -- Computer simulation, Heat -- Conduction -- Mathematical models, Fourier series | ||||
Series Name: | IEEE INDUSTRY APPLICATIONS SOCIETY ANNUAL MEETING | ||||
Journal or Publication Title: | Industry Applications Society. IEEE - IAS Annual Meeting. Conference Record | ||||
Publisher: | IEEE | ||||
ISBN: | 978-1-4244-2278-4 | ||||
ISSN: | 0197-2618 | ||||
Official Date: | 2008 | ||||
Dates: |
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Volume: | Vol.1-5 | ||||
Number of Pages: | 8 | ||||
Page Range: | pp. 1457-1464 | ||||
DOI: | 10.1109/08IAS.2008.359 | ||||
Status: | Not Peer Reviewed | ||||
Publication Status: | Published | ||||
Access rights to Published version: | Restricted or Subscription Access | ||||
Funder: | Toyota Jidōsha Kabushiki Kaisha | ||||
Title of Event: | IEEE Industry-Applications-Society Annual Meeting | ||||
Type of Event: | Conference | ||||
Location of Event: | Alberta, Canada | ||||
Date(s) of Event: | Oct 05-09, 2008 |
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