The Library
High-resolution, air-coupled ultrasonic imaging of thin materials
Tools
UNSPECIFIED (2003) High-resolution, air-coupled ultrasonic imaging of thin materials. IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, 50 (11). pp. 1516-1524. ISSN 0885-3010.
Research output not available from this repository.
Request-a-Copy directly from author or use local Library Get it For Me service.
Abstract
This paper describes the use of a focused air-coupled capacitance transducer combined with pulse compression techniques to form high-resolution images of thin materials in air. The focusing of the device is achieved by using an off axis parabolic mirror. The lateral resolution of the focused transducer, operating over a bandwidth of 1.2 MHz, was found to be less than 0.5 mm. A combination of the focused transducer as a source and a planar receiver in through-transmission mode has been developed for the measurement of different features in paper products, with a lateral resolution in through-transmission imaging of similar to0.4 mm. Images in air of thin samples such as bank notes, high-quality writing paper, stamps, and sealed joints were obtained without contact to the sample.
Item Type: | Journal Article | ||||
---|---|---|---|---|---|
Subjects: | T Technology > TA Engineering (General). Civil engineering (General) T Technology > TK Electrical engineering. Electronics Nuclear engineering |
||||
Journal or Publication Title: | IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL | ||||
Publisher: | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | ||||
ISSN: | 0885-3010 | ||||
Official Date: | November 2003 | ||||
Dates: |
|
||||
Volume: | 50 | ||||
Number: | 11 | ||||
Number of Pages: | 9 | ||||
Page Range: | pp. 1516-1524 | ||||
Publication Status: | Published |
Data sourced from Thomson Reuters' Web of Knowledge
Request changes or add full text files to a record
Repository staff actions (login required)
View Item |