Number of items: 4.
2012
Swan, I. R. (Ian R.), Bryant, Angus T. and Mawby, P. A. (Philip A.)
(2012)
Fast 3D thermal simulation of power module packaging.
International Journal of Numerical Modelling : Electronic Networks, Devices and Fields, Vol.25
(No.4).
pp. 378-399.
doi:10.1002/jnm.841
ISSN 0894-3370.
2010
Swan, I. R. (Ian R.)
(2010)
3-D thermal modelling of power device packaging.
PhD thesis, University of Warwick.
2009
Swan, I. R. (Ian R.), Bryant, A. T., Parker-Allotey, Nii-Adotei and Mawby, P. A. (Philip A.)
(2009)
3-D thermal simulation of power module packaging.
In: IEEE Energy Conversion Congress and Exposition, San Jose, CA, Sepbember 20-24, 2009. Published in: 2009 IEEE Energy Conversion Congress and Exposition, Vols. 1-6
pp. 1185-1192.
ISBN 978-1-4244-2892-2.
doi:10.1109/ECCE.2009.5316235
2008
Swan, I. R. (Ian R.), Bryant, Angus T. and Mawby, P. A. (Philip A.)
(2008)
Fast thermal models for power device packaging.
In: IEEE Industry-Applications-Society Annual Meeting, Alberta, Canada, Oct 05-09, 2008. Published in: Industry Applications Society. IEEE - IAS Annual Meeting. Conference Record, Vol.1-5
pp. 1457-1464.
ISBN 978-1-4244-2278-4.
doi:10.1109/08IAS.2008.359
ISSN 0197-2618.
This list was generated on Thu Mar 28 17:57:32 2024 GMT.