Number of items: 5.
2022
Yang, Jianxiong, Che, Yanbo, Ran, Li, Hu, Borong and Du, Mingxing
(2022)
Junction temperature estimation approach based on TSEPs in multichip IGBT modules.
Journal of Power Electronics, 22
.
pp. 1596-1605.
doi:10.1007/s43236-022-00465-3
ISSN 1598-2092.
Hu, Zedong, Hu, Borong, Ran, Li, Tavner, Peter, Kong, Hua, Mawby, Philip A. and Wu, Ruizhu
(2022)
Monitoring power module solder degradation from heat dissipation in two opposite directions.
IEEE Transactions on Power Electronics, 37
(8).
pp. 9754-9766.
doi:10.1109/TPEL.2022.3157464
ISSN 0885-8993.
2021
Hu, Borong
(2021)
Uneven degradation and condition monitoring of multi-chip power modules for wind turbines.
PhD thesis, University of Warwick.
2018
Hu, Borong, Konaklieva, Sylvia, Ran, Li, Kourra, Nadia, Williams, Mark A., Lai, Wei and Mawby, Philip. A.
(2018)
Long term reliability of power modules with low amplitude thermomechanical stresses and initial defects.
In: 2018 IEEE Energy Conversion Congress and Exposition (ECCE), Portland, OR, USA, 23 - 27 Sep 2018. Published in: 2018 IEEE Energy Conversion Congress and Exposition (ECCE)
ISBN 9781479973125.
doi:10.1109/ECCE.2018.8558137
2017
Hu, Borong, Ortiz Gonzalez, Jose Angel, Ran, Li, Ren, Hai, Zeng, Zheng, Lai, Wei, Gao, Bing, Alatise, Olayiwola M., Lu, Hua, Bailey, Christopher and Mawby, P. A. (Philip A.)
(2017)
Failure and reliability analysis of a SiC power module based on stress comparison to a Si device.
IEEE Transactions on Device and Materials Reliability, 17
(4).
pp. 727-737.
doi:10.1109/TDMR.2017.2766692
ISSN 1530-4388.
This list was generated on Fri Apr 19 07:49:47 2024 BST.