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Status and prospects of cubic silicon carbide power electronics device technology
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Li, Fan, Roccaforte, Fabrizio, Greco, Giuseppe, Fiorenza, Patrick, La Via, Francesco, Pérez-Tomas, Amador, Evans, Jonathan, Fisher, Craig, Monaghan, Finn, Mawby, Philip. A. and Jennings, Mike (2021) Status and prospects of cubic silicon carbide power electronics device technology. Materials, 14 (19). e5831. doi:10.3390/ma14195831 ISSN 1996-1944.
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Official URL: https://doi.org/10.3390/ma14195831
Abstract
Wide bandgap (WBG) semiconductors are becoming more widely accepted for use in power electronics due to their superior electrical energy efficiencies and improved power densities. Although WBG cubic silicon carbide (3C-SiC) displays a modest bandgap compared to its commercial counterparts (4H-silicon carbide and gallium nitride), this material has excellent attributes as the WBG semiconductor of choice for low-resistance, reliable diode and MOS devices. At present the material remains firmly in the research domain due to numerous technological impediments that hamper its widespread adoption. The most obvious obstacle is defect-free 3C-SiC; presently, 3C-SiC bulk and heteroepitaxial (on-silicon) display high defect densities such as stacking faults and antiphase boundaries. Moreover, heteroepitaxy 3C-SiC-on-silicon means low temperature processing budgets are imposed upon the system (max. temperature limited to ~1400 °C) limiting selective doping realisation. This paper will give a brief overview of some of the scientific aspects associated with 3C-SiC processing technology in addition to focussing on the latest state of the art results. A particular focus will be placed upon key process steps such as Schottky and ohmic contacts, ion implantation and MOS processing including reliability. Finally, the paper will discuss some device prototypes (diodes and MOSFET) and draw conclusions around the prospects for 3C-SiC devices based upon the processing technology presented.
Item Type: | Journal Article | ||||||
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Subjects: | Q Science > QC Physics T Technology > TP Chemical technology |
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Divisions: | Faculty of Science, Engineering and Medicine > Engineering > Engineering | ||||||
SWORD Depositor: | Library Publications Router | ||||||
Library of Congress Subject Headings (LCSH): | Silicon carbide, Power electronics, Wide gap semiconductors -- Materials | ||||||
Journal or Publication Title: | Materials | ||||||
Publisher: | MDPI | ||||||
ISSN: | 1996-1944 | ||||||
Official Date: | 5 October 2021 | ||||||
Dates: |
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Volume: | 14 | ||||||
Number: | 19 | ||||||
Article Number: | e5831 | ||||||
DOI: | 10.3390/ma14195831 | ||||||
Status: | Peer Reviewed | ||||||
Publication Status: | Published | ||||||
Access rights to Published version: | Open Access (Creative Commons) | ||||||
Date of first compliant deposit: | 28 October 2021 | ||||||
Date of first compliant Open Access: | 28 October 2021 | ||||||
RIOXX Funder/Project Grant: |
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