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Monitoring power module solder degradation from heat dissipation in two opposite directions
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Hu, Zedong, Hu, Borong, Ran, Li, Tavner, Peter, Kong, Hua, Mawby, Philip A. and Wu, Ruizhu (2022) Monitoring power module solder degradation from heat dissipation in two opposite directions. IEEE Transactions on Power Electronics, 37 (8). pp. 9754-9766. doi:10.1109/TPEL.2022.3157464 ISSN 0885-8993.
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WRAP-Monitoring-power-module-solder-degradation-heat-dissipation-two-opposite-directions-2022.pdf - Accepted Version - Requires a PDF viewer. Download (1429Kb) | Preview |
Official URL: https://doi.org/10.1109/TPEL.2022.3157464
Abstract
Solder degradation is still a main failure mechanism for power semiconductor modules. This study proposes a monitoring method to detect the relative change in heat dissipation from a module in two opposing directions, affected by the degradation: upwards via the silicone gel and downwards via the solder layer to the heatsink. The method is based on external module package measurements, and a Condition Indicator is defined as the ratio of heat transfer rates in the two directions. The expected response of to the level of degradation is analysed for different module operating points and external environment conditions. The method is demonstrated by experiment.
Item Type: | Journal Article | |||||||||
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Subjects: | T Technology > TA Engineering (General). Civil engineering (General) | |||||||||
Divisions: | Faculty of Science, Engineering and Medicine > Engineering > Engineering | |||||||||
Library of Congress Subject Headings (LCSH): | Solder and soldering, Heat -- Transmission, Temperature measurements | |||||||||
Journal or Publication Title: | IEEE Transactions on Power Electronics | |||||||||
Publisher: | IEEE | |||||||||
ISSN: | 0885-8993 | |||||||||
Official Date: | August 2022 | |||||||||
Dates: |
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Volume: | 37 | |||||||||
Number: | 8 | |||||||||
Page Range: | pp. 9754-9766 | |||||||||
DOI: | 10.1109/TPEL.2022.3157464 | |||||||||
Status: | Peer Reviewed | |||||||||
Publication Status: | Published | |||||||||
Reuse Statement (publisher, data, author rights): | © 2022 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. | |||||||||
Access rights to Published version: | Restricted or Subscription Access | |||||||||
Date of first compliant deposit: | 24 March 2022 | |||||||||
Date of first compliant Open Access: | 25 March 2022 | |||||||||
RIOXX Funder/Project Grant: |
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