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REACTION PROCESSES BETWEEN SILVER OR ZINC DOPED PB-SN SOLDER AND GOLD
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UNSPECIFIED (1992) REACTION PROCESSES BETWEEN SILVER OR ZINC DOPED PB-SN SOLDER AND GOLD. MATERIALS SCIENCE AND TECHNOLOGY, 8 (10). pp. 930-937. ISSN 0267-0836.
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Abstract
The microstructures of soldered joints made on gold using silver or zinc doped Pb-Sn solder have been studied in the scanning electron microscope before and after accelerated aging. Layers of Au-Sn intermetallic compounds form between the unreacted gold and the solder as a result of the diffusion of gold through the product layers. The reaction kinetics has been studied as a function of temperature for the silver doped system and, in the initial stages, was found to be parabolic with an activation energy of (0.86 +/- 0.03) eV. This is the same as for joints made using undoped Pb-Sn solder. As in the undoped system, the growth of the product layers subsequently fell below the t1/2 dependence and loss of joint strength occurred only some time after all the gold had been converted.
Item Type: | Journal Article | ||||
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Subjects: | T Technology > TA Engineering (General). Civil engineering (General) T Technology > TN Mining engineering. Metallurgy |
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Journal or Publication Title: | MATERIALS SCIENCE AND TECHNOLOGY | ||||
Publisher: | INST MATERIALS | ||||
ISSN: | 0267-0836 | ||||
Official Date: | October 1992 | ||||
Dates: |
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Volume: | 8 | ||||
Number: | 10 | ||||
Number of Pages: | 8 | ||||
Page Range: | pp. 930-937 | ||||
Publication Status: | Published |
Data sourced from Thomson Reuters' Web of Knowledge
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