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Fractal growth of copper electrodeposits
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Brady, R. M. and Ball, Robin (1985) Fractal growth of copper electrodeposits. Journal of Statistical Physics, Vol.39 (No.1-2). p. 247. doi:10.1038/309225a0 ISSN 0022-4715.
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Official URL: http://dx.doi.org/10.1038/309225a0
Item Type: | Journal Article | ||||
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Subjects: | Q Science > QC Physics Q Science > QD Chemistry |
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Divisions: | Faculty of Science, Engineering and Medicine > Science > Physics | ||||
Library of Congress Subject Headings (LCSH): | Electroforming, Copper plating, Copper -- Electrometallurgy, Aggregation (Chemistry) -- Computer simulation, Fractals | ||||
Journal or Publication Title: | Journal of Statistical Physics | ||||
Publisher: | Springer New York LLC | ||||
ISSN: | 0022-4715 | ||||
Official Date: | 1985 | ||||
Dates: |
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Volume: | Vol.39 | ||||
Number: | No.1-2 | ||||
Page Range: | p. 247 | ||||
DOI: | 10.1038/309225a0 | ||||
Status: | Peer Reviewed | ||||
Publication Status: | Published | ||||
Description: | Abstract |
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Version or Related Resource: | Brady, R. M. and Ball, R. C. (1984). Fractal growth of copper electrodeposits. Nature, 309(5965), pp. 225-229. | ||||
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